• Choice of multiple options for medical and dental insurance including options with a FSA or HSA
• 401(k) with up to 4% company match
• 15-days of accrued PTO and 9 company paid holidays
• Voluntary benefits: vision, long-term disability, and life insurance
• Salary: $115,000-140,000/year DOE

• Conduct method development for electrical fault isolation of component level electronics via TDR, Laser-Thermal (XIVA/OBRICH), magnetic current imaging (MCI), lock-in thermography (LIT).
• Analyze circuits and topologies to identify marginal failure root causes.
• Metallurgical sample preparation including potting/cross-sectioning/polishing, dye/pry, de-capping. 

• Bachelor’s degree in electrical engineering or related technical field or equivalent experience
• 2 years’ experience performing fault isolation (XIVA / OBIRCH, MCI, LIT, TDR, or trace probing) on integrated electronic devices.
• 2 years of experience in metallurgical cross-sectioning, de-capping, dye/pry.
• Ability to read schematics, bill of materials (BOMs), and understand PCB layout, and component level data sheets.
• Strong written and verbal English language communication skills.
• Excellent teamwork/interpersonal skills and the ability to communicate effectively. Demonstrated ability to work collaboratively, both within and outside one's own work group.
• Demonstrate commitment and adherence to SIGMADESIGN Core Values.
• Pass a post-offer background verification.

• Knowledge of integrated electronics fabrication processes and experience with electro-mechanical systems assembly
• 1 years experience in analytical and FA techniques, including C-SAM, FIB-SEM, and XRD/XRF
• Experience with materials relevant to flexible electronic devices, i.e. photo patternable polymeric resins, elastomers, conductors, underfills, encapsulant materials, thermal materials

SIGMADESIGN is an Equal Opportunity Employer