Responsibilities:

• Manage all aspects of PCB design, work with hardware design engineers and PCB/ Assembly vendors to determine PCB stack-up, apply design constraints, perform component placement, signal routing, and DFM.
• Create OrCAD schematic symbols, PCB footprint and 3D component models in Allegro, and maintain ECAD library databases.
• Support layout of mixed signal, high-speed, and RF multi-layer HDI circuit boards.
• Prepare fabrication notes, assembly notes, and all deliverables, such as Gerber files, drill charts, PCB assembly BOMs, and other PCB and assembly related documents required by PCB fabrication vendors to build circuit boards for prototypes and products.
• Work with local and international PCB fabrication vendors and contract manufacturers for addressing DFM concerns and providing feedback.

Must-Have Skills:

• 7 years of PCB layout experience.
• 5 years of working with Cadence Allegro and Aurora ECAD tools.
• Good communication skills and experience with productivity tools such as MS Word, Excel, and PowerPoint.

Nice-to-have Skills:

• Strong knowledge in PCB fabrication process.
• Knowledge of consumer electronics manufacturing process.
• Knowledge in high-speed PCB design.

Minimum Qualifications:

• 5 years of experience using Cadence OrCAD/ Allegro for PCB design is required.
• Knowledge of PCB Design, PCB stack-up and materials, good understanding of PCB technology and process.
• PCB design experience in analog, high speed digital, mixed signal design, and RF. Experience with all phases of design including thermal mitigation, impedance control, EMC, grounding, and PCB reliability.
• Experience and knowledge of IPC standards and practices.
• Proven track record of managing all aspects of PCB design used in high volume products.
• Experience with HDI, flex, and Rigid-Flex board design and manufacturing.

Preferred Qualifications:

• Experience with mSAP technologies.
• Experience with PCB design with Embedded Components.
• Experience with assembly for SiP technologies.