Title: Intern R&D

Travel: No Travel Required

Company: Tellabs Enterprise Inc.

Location: Dallas Facility

The Engineering Intern works under general direction, follows oral and/or written instructions of Engineering management team and performs various engineering support responsibilities associated with software, hardware, repair and testing processes to assisting in producing functional tested electronic assemblies, electro-mechanical assemblies or associated sub-assemblies.
 
Essential Job Responsibilities 

• Perform basic product design modifications. 
• Develop basic detail and assembly drawings for products and equipment. 
• Perform engineering change processes as necessary to support existing products. 
• Create 3-D models from 2-D drawings and other design tools as applicable. 
• Generate and scan prints and has ability to perform mechanical design calculations. 
• Test prototypes and standard products and write reports to document the results. 
• Categorize a wide arrangement of existing parts.
• Performs simple and complex repairs on RMA assemblies.
• Provides assistance with failure analysis of FMAs and properly documents findings.
• Follows all applicable work instructions to perform repair and testing processes.
• Sets up, maintains and repairs manual and automated test equipment used to test and repair Tellabs products. This includes maintaining and modifying test code and scripts as needed.
• Other related duties as assigned. 

 Minimum Qualifications:

• College student pursuing bachelor’s or master’s degree engineering or other related technical degree plan. 
• The ability to communicate fluently in English (both verbally and written) and have ability to read, write and comprehend complex technical instructions, correspondence, and memos.
• Strong communication skills with ability and confidence to effectively present technical and non- technical information in one-on-one and small group situations to other employees, supervisors, or engineers.
• Proficient in use of personal computers as part of daily work, including knowledge of the Microsoft Office suite. Ability to use E-mail and the Autodesk Fusion document control system to retrieve and submit on-line documentation. Ability to use the Oracle NetSuite business data system for entering and accessing data related to repair activities.
• Ability to troubleshoots electronics devices down to the component level and resolves problems involving circuit analysis, fault isolation, programmable components programming and signal flow tracing.
• Able to apply electronic circuit analysis principles to make clear determinations while troubleshooting.
• Ability to read and understand engineering documentation including schematics, block diagrams, flow charts etc.
• Proficient with through-hole and surface mount soldering skills. Ability to perform BGA rework is a plus.
• Able to use automated and semi-automated test equipment, multimeters, oscilloscopes, signal generators, signal analyzers, and any other devices used in electronic troubleshooting and repair.
• Ability to work with various programming languages to troubleshoot, modify and update test software and scripts.
• Ability to manage parts inventory.
• Must have a flexible approach in order to react to changing schedules of work with an excellent attention to detail.
• Able to work independently as well as with a team to meet the company goals.
• Ability to stand for prolonged periods of time and lift up to 50lbs required. 

Only fully complete submissions will be reviewed for consideration. 

No relocation provided.

No sponsorship provided.

Tellabs participates in E-Verify and is an Equal Opportunity Employer.

Tellabs encourages qualified minorities, women, individuals with disabilities, veterans, and any other legally protected status to apply. The company complies with all applicable federal, state and local laws and regulations throughout the hiring process.

Qualified candidates should apply at https://www.tellabs.com/careers/