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31 MSI - (Marvell Semiconductor Inc.) US
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Marvell Semiconductor, Inc.
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Principal Package Engineer
$166k-201k (estimate)
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31 MSI - (Marvell Semiconductor Inc.) US is Hiring a Principal Package Engineer Near Santa Clara, CA

About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your Impact Marvell Semiconductor, a global leader in the development and production of high-performance semiconductor technology, is seeking a seasoned Principal Packaging Engineer to join our team in Santa Clara, CA. This role is pivotal for driving innovation and excellence in our packaging engineering processes and outcomes. The successful candidate will have a deep technical background in semiconductor packaging technologies, combined with proven experience in leading and managing a team of engineers. What You Can Expect Potentially lead a team of 3 package engineers, setting high standards for execution and innovation, while fostering a collaborative and results-driven environment. Strategically manage the development and implementation of advanced packaging technologies to enhance product performance and reliability. Provide technical leadership in the design, simulation, and analysis of semiconductor packages to ensure optimal thermal, mechanical, and electrical performance. Work closely with cross-functional teams (R&D, design, manufacturing, quality, and supply chain) to ensure seamless integration and alignment of packaging strategies with company goals. Drive continuous improvement initiatives in packaging processes, tools, and methodologies to reduce cost, improve quality, and enhance yield. Manage the team's project portfolio, prioritizing tasks and allocating resources to meet deadlines and business objectives efficiently. Mentor and develop team members, enhancing their skills and career progression through targeted training and challenging project assignments. Stay abreast of industry trends, technological advancements, and competitive strategies in semiconductor packaging to ensure Marvell remains at the cutting edge. Lead troubleshooting and problem-solving efforts related to packaging design and process issues, implementing robust solutions to prevent recurrence. Contribute to the intellectual property portfolio of the company through innovation and patent generation in the field of semiconductor packaging. What We're Looking For Bachelor’s degree in Mechanical Engineering, Materials Science, Chemical Engineering, or a related technical field; advanced degree (MS or PhD) preferred. Minimum of 10 years of experience in semiconductor packaging engineering, with a comprehensive understanding of advanced packaging technologies such as 2.5D, 3D IC, Flip Chip, WLCSP, and Fan-Out. At least 5 years of experience in a leadership or management role, with a proven track record of building, leading, and mentoring a high-performing engineering team. Strong project management skills, with the ability to lead complex projects across cross-functional teams. Excellent analytical and problem-solving skills, with a strong focus on results and a commitment to quality. Exceptional communication and interpersonal skills, capable of fostering strong internal and external relationships. Demonstrated ability to operate effectively in a fast-paced, dynamic environment, adapting to evolving business and technical challenges. Familiarity with relevant industry standards and regulatory requirements related to semiconductor packaging. #LI-MC1 Expected Base Pay Range (USD) 130,650 - 195,700, $ per annum The successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions. Additional Compensation and Benefit Elements At Marvell, we offer a total compensation package with a base, bonus and equity.Health and financial wellbeing are part of the package. That means flexible time off, 401k, plus a year-end shutdown, floating holidays, paid time off to volunteer. Have a question about our benefits packages - health or financial? Ask your recruiter during the interview process. This role is eligible for our hybrid work model in which you will be able to split time between working from home and on-site in a Marvell office. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status. Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at TAOps@marvell.com. Join our talent community to hear about company news, job openings and events. Join our Talent Community! Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Recruitment fraud is a well-known way that third parties try to get personal information or to steal money from you. Please review Marvell’s guidance here to learn more on how you can protect yourself.

Job Summary

JOB TYPE

Other

SALARY

$166k-201k (estimate)

POST DATE

05/28/2024

EXPIRATION DATE

07/27/2024

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31 MSI - (Marvell Semiconductor Inc.) US
Other
$78k-96k (estimate)
Just Posted
31 MSI - (Marvell Semiconductor Inc.) US
Full Time
$127k-164k (estimate)
Just Posted

The job skills required for Principal Package Engineer include Packaging, Packaging Design, Project Management, Packaging Engineering, Leadership, Supply Chain, etc. Having related job skills and expertise will give you an advantage when applying to be a Principal Package Engineer. That makes you unique and can impact how much salary you can get paid. Below are job openings related to skills required by Principal Package Engineer. Select any job title you are interested in and start to search job requirements.

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The following is the career advancement route for Principal Package Engineer positions, which can be used as a reference in future career path planning. As a Principal Package Engineer, it can be promoted into senior positions as a Packaging Engineer V that are expected to handle more key tasks, people in this role will get a higher salary paid than an ordinary Principal Package Engineer. You can explore the career advancement for a Principal Package Engineer below and select your interested title to get hiring information.

Marvell Semiconductor, Inc.
Full Time
$166k-201k (estimate)
4 Weeks Ago