What are the responsibilities and job description for the Module Development Engineer position at SoTalent?
Job Title: Module Development Engineer
Location: Vernonia, Oregon, United States
Type: Full Time
Our Client is seeking a highly accomplished Senior/Principal Dry Etch Process Expert to lead advanced semiconductor process innovations and drive next-generation manufacturing capabilities. This role is ideal for a deeply technical leader with a strong track record of translating research into scalable, high-volume production solutions.
Key Responsibilities:
- Lead the development and optimization of advanced dry etch processes to support high-volume semiconductor manufacturing
- Define long-term technical strategy and roadmap for etch technologies aligned with product and process goals
- Solve complex process challenges impacting yield, reliability, and performance across technology nodes
- Apply advanced data analytics, statistical modeling, and design of experiments (DOE) to optimize process performance
- Drive innovation in plasma-based etching, including process integration for advanced device architectures
- Influence technical decisions across cross-functional teams without direct authority
- Collaborate with device, integration, yield, and equipment teams to align on technology development strategies
- Mentor engineers and elevate technical capabilities across the organization
- Contribute to technical thought leadership through patents, publications, or internal innovations
What We’re Looking For:
- Deep expertise in plasma physics, plasma-surface interactions, and advanced etch process control
- Strong understanding of pattern fidelity, selectivity, defectivity, and profile optimization
- Proven ability to transition R&D concepts into high-volume manufacturing solutions
- Recognized technical authority with the ability to influence across teams and organizations
- Strong problem-solving skills and the ability to break down complex technical challenges
Preferred Experience:
- Leadership in next-generation etch technologies for advanced semiconductor nodes (e.g., FinFET, GAA, nanoscale architectures)
- Experience with high aspect ratio etching, atomic layer etching (ALE), EUV integration, and emerging etch techniques
- Expertise in materials and device characterization tools (e.g., SEM, TEM, AFM, XPS)
- Track record of solving critical yield or cost challenges across multiple product generations
- Experience developing long-term process and technology roadmaps
Qualifications:
- PhD with 10 years, or Master’s degree with 15 years of relevant experience in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a related field
- Extensive experience in dry etch semiconductor manufacturing, preferably within advanced fabrication environments
- Proven leadership in complex process development and platform-level innovation