What are the responsibilities and job description for the Advanced Packaging Engineer position at Piper Companies?
Piper Companies is seeking an Advanced Packaging Engineer to support a leading innovator in the semiconductor and high‑performance computing industry for a permanent onsite role based in Saratoga, CA. The Advanced Packaging Engineer will contribute to next‑generation hardware by driving system‑level module integration and advanced IC packaging efforts in collaboration with global manufacturing partners.
Responsibilities of the Advanced Packaging Engineer include:
Salary Range: $230,000-$260,000/year (USD)
Comprehensive Benefits: Medical, Dental, Vision, sick leave if required by law, and 401K
This job opens for applications on 4/3/26. Applications for this job will be accepted for at least 30 days from the posting date.
Keywords: advanced packaging, organic substrates, SMT assembly, IC integration, module packaging, flip chip, 2.5D integration, CoWoS, interposers, mechanical modeling, warpage, stress analysis, substrate design, manufacturing readiness, yield improvement, OSAT, foundry engagement, semiconductor hardware, system module engineering, high‑performance computing.
Responsibilities of the Advanced Packaging Engineer include:
- Lead the development and industrialization of complex system modules built with organic substrates, thermal solutions, interposers, boards, and structural components
- Oversee manufacturing readiness with contract manufacturers, driving build plans, yield improvement initiatives, and qualification activities
- Serve as the technical authority for organic substrate engineering, including stack‑up definition, embedded component technologies, and mechanical/electrical verification
- Guide advanced packaging initiatives involving flip‑chip designs, 2.5D integration, and engagement with OSATs and foundry partners
- Partner closely with teams in the U.S. and Taiwan to support substrate fabrication, SMT process optimization, failure analysis, and continuous improvement
- 8 years of experience in system‑level packaging, module assembly, or advanced semiconductor packaging
- Strong background working with organic substrates, SMT assembly, rework processes, and high‑density package technologies
- Hands‑on experience with flip‑chip architectures, mechanical modeling impacts (warpage, stress, coplanarity), and qualification methodologies
- Proven success collaborating directly with overseas subcontractors, OSATs, and foundry partners on high‑volume manufacturing programs
- Bachelor’s degree or higher in Electrical Engineering, Mechanical Engineering, Materials Science, or a closely related discipline
Salary Range: $230,000-$260,000/year (USD)
Comprehensive Benefits: Medical, Dental, Vision, sick leave if required by law, and 401K
This job opens for applications on 4/3/26. Applications for this job will be accepted for at least 30 days from the posting date.
Keywords: advanced packaging, organic substrates, SMT assembly, IC integration, module packaging, flip chip, 2.5D integration, CoWoS, interposers, mechanical modeling, warpage, stress analysis, substrate design, manufacturing readiness, yield improvement, OSAT, foundry engagement, semiconductor hardware, system module engineering, high‑performance computing.
Salary : $230,000 - $260,000