Description

Job Purpose

The Silicon Photonics Development Engineer is responsible for the development of state-of-the-art high-performance Silicon photonic chips based on Skorpios’ established platform for high-speed communications. The job level will be commensurate with the candidate’s relevant experience.

Essential Responsibilities

Reasonable accommodations may be made to enable individuals with disabilities to perform these essential responsibilities.

• Develop advanced Silicon photonic chips for high-speed optical communications. The chips must be designed for manufacturing with Skorpios’ established CMOS process, including the heterogeneous integration of III-V material onto SOI wafers.
• Design active and passive photonic devices for optical communications, including lasers, modulators, photodetectors, Mux/Demux, gratings, polarization beam splitters, polarization rotators, optical spot-size converters, optical couplers, optical filters, etc.
• Run optical and electrical simulation software to optimize device design and performance.
• Create design of experiments (DOEs) to explore the effects of device parameters and fabrication process variations for optimized performance. 
• Analyze simulation data, organize simulation and design reports, conduct design review and present to multiple functional teams.
• Perform optical chip layout using layout software, conduct design rule checking (DRC) and layout review, implement fixes based on team feedbacks, tape out layout files (GDS) to internal fabrication team.
• Perform optical device testing, including electrical probing optical chips, and active fiber alignment for optical coupling. Measure optical loss, optical spectrum, laser characteristics, modulator transfer curves and bandwidth, photodetector responsivity and bandwidth, etc.
• Perform optical transceiver module testing, measure TX output power and eye diagrams, RX Bit Error Rate (BER) and sensitivity, over the temperature and voltage corners. Tune the operating control parameters to optimize the performance.
• Design and configure test setups, including test fixtures, probes, instruments, cables, positioners, power suppliers, ovens, etc. Search for required equipment online and contact vendors to discuss technical requirements and request quote, work with purchasing team to complete the purchasing.
• Debug possible issues in device and module performance by simulations and testing, propose fixing solutions, write simulation and testing reports, and present to the team.
• Monitor the wafer lot progress in the fab, configure and modify the process flow, provide remote engineering support to the wafer processing, attend daily fab pass-down meetings, write instructions for wafer dicing, bar polishing, AR coating, FIB/SEM, photo imaging, etc.
• Support the fabrication team. Provide on-site engineering support, help the fab engineers and technicians to run the tools, analyze the metrology data, develop the processing recipe.
• Write invention disclosure document, work with patent attorney for patent applications.
• Work closely with teammates, including design engineers, test engineers, mechanical engineers, software engineers, fabrication team, packaging team, module development team, purchasing, sales, and quality management teams, etc.

Competencies

• Broad and deep technical background
• Versatile engineering experience and skills
• Flexible and hands-on mindset
• Excellent communication skills
• Collaboration
• Quick Learner
• Self-starter
• Prioritization
• Accountability
• Innovative

Supervisory Responsibilities

None 

Work Environment

60% of work is performed in the office area, which is a temperature-controlled environment in an open cubicle setting. Frequent interruptions and conversational noise can be expected.

30% of work is performed in the testing lab, which is a temperature-controlled environment that requires the use of lab coat, ESD wrist and foot straps. Prolonged standing may be required. Some machine noise can be expected.

10% of work may be performed in the fab, which a temperature-controlled cleanroom environment that requires the use of a full-body gown, over-boots, over-hood, safety glasses, and other PPE. Frequent gowning and de-gowning are required. Frequent interruptions, static noise, and alarms (auditory and flashing lights) can be expected.

Physical Demands

• Frequently in a stationary position, often sitting and/or standing for prolonged periods (3 hours)
• Frequently viewing a computer monitor for prolonged periods (3 hours)
• Frequently walking around the Fab for prolonged periods (3 hours)
• Occasionally required to push and/or pull 50 lbs objects, such as tool components
• Occasionally required to lift 50 lbs and occasionally carry that amount short distances (# ft)
• Occasionally required reach, bend, twist, squat, kneel, and stoop to access and work on tools in the testing lab and fab
• May often require repetitive motions involving the wrists, hands, and/or fingers
• May require different positions and motions in tight and confined spaces
• Occasionally required to handle items using small ranges of motion (e.g. fingers and hands) and large ranges of motion (e.g., full-arms and shoulders) for carrying cassettes and lot boxes
• Constantly required to wear lab coat or PPE 

Benefits

Medical

Dental

Vision

Critical Illness

Company Paid Life Insurance

Company Paid Disability (New Mexico)

401k

Generous PTO Plan

Generous Holiday Plan (includes Birthday Leave)

Requirements

Travel Requirements

Less than 25% anticipated

Required Education and Experience

• Required Education and ExperienceMaster’s degree in Electrical Engineering, Optical Engineering, Physics, or Communication Science with 7 years of experience; or PhD in the same areas with 2 years of experience
• Industrial experience in optical device development for high-speed communications
• Successful experience in optical device design and testing
• Familiar with optical and electrical simulation software
• Fluent in at least one of the general engineering software tools, such as Matlab, Python, JMP
• Good skills in data extraction, analysis, and writing up reports
• Strong ability to troubleshoot optical chip issues and address root causes
• Basic understanding of semiconductor processing
• Ability to plan and prioritize activities, perform and monitor multiple overlapping tasks to meet goals and timelines

Preferred Education and Experience

• PhD in Electrical Engineering, Optical Engineering, Physics, or Communication Science with 5 years of experience
• Understand laser physics, familiar with laser material including quantum wells
• Understand transmission of high-speed microwave signal
• Development experience of semiconductor lasers, high speed modulators, or photodetectors
• Extensive experience in III-V optical devices and Silicon photonic devices development
• Software skills for test automation, including C #, Visual Basic, Labview, etc
• Processing experience in a fab, including lithography, etching, deposition, cleaning, etc

Work Authorization/Security Clearance Requirements

Must meet ITAR citizenship requirements