Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: 3D metrology spanning the chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Job Summary & Responsibilities Mechanical Engineer Responsible for mechanical and electronic packaging design, detail drawings, ECN processing and BOM release within Windchill and SAP. Will work with other engineers locally and remotely on larger projects in a collaborative team environment. Qualifications 5 years of experience in Mechanical Engineering of complex machines and systems. Highly skilled in SolidWorks CAD, with some experience in FEA or other analytical computations. Comfortable working in a team environment to turn project requirements and challenges into effective, elegant solutions. Strong skills also required in MRP (Windchill and SAP preferred) and MS Office applications (Word, Excel) Attitude and aptitude are most critical for success in this challenging and dynamic role. Onto Innovation is committed to creating a diverse environment and is proud to be an equal-opportunity employer. We offer competitive salaries and a generous benefits package, including health/dental/vision/life/disability, PTO, 401K plan with employer match, and an Employee Stock Ownership Program (ESOP) along with health & wellness initiatives. We provide a collaborative working environment along with resources, and state-of-the-art tools & equipment to promote success; and a welcoming, inclusive corporate culture where individuals are recognized for their contributions. Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: 3D metrology spanning the chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain help our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization. Additional information can be found at http://www.ontoinnovation.com.