Description

SLD Laser, a world leader in commercialization of gallium nitride (GaN) based laser light sources, was acquired by KYOCERA Corporation and has commenced operations as a wholly owned subsidiary and group company of KYOCERA Corporation under the name KYOCERA SLD Laser, Inc. (KSLD). KSLD is commercializing a new generation of gallium nitride-based laser light sources. KSLD’s high luminance LaserLight^TM sources are utilized in a myriad of applications including automotive & mobility, specialty & portable lighting, entertainment & outdoor, projection & AR/VR displays, biomedical instrumentation & therapeutics, and industrial imaging & material processing.

The company is ISO 9001 certified and automotive compliant to IATF 16949, and operates facilities in Santa Barbara, CA and in Fremont, CA. KSLD’s high luminance LaserLightTM sources are UL and IEC safety certified. The company was recently ranked 7th in Fortune magazine’s “2021 Best Workplaces in Manufacturing & ProductionTM,” having promoted an employee-centric corporate culture since its founding.

KSLD will continue to pioneer the future of light by developing, manufacturing and marketing innovative laser-based products with high efficiency and luminance for mobility, specialty lighting, consumer, and industrial applications.

To learn more about KSLD, visit www.kyocera-sldlaser.com or contact the company at info@kyocera-sldlaser.com or 1-866-753-5273.

Qualifications

Job Description:

Specific Responsibilities
• Process production laser lots in wafer fab (Lithography, thin film deposition, dry etch, wet etch, microscopy, metrology)
• Process test lots / split lots and help develop new wafer fab processes
• Support process engineers on process maintenance and improvement
• Track process steps through electronic traveler system / MES
• Data entry and process calculations such as deposition and etch rates and time

Experience and Skills

• Experience with several of the following processes: lithography (spin coat, stepper, mask aligner), thin film deposition (sputter, E-beam, PECVD), wet etch, dry etch (RIE, ICP RIE), saw dicing, laser scribe and break
• Ability to work with minimal guidance in a dynamic environment
• Good communication skills. Able to work alongside engineering staff and technicians.
• III-V laser experience preferred, but not required. Must have some wafer fab experience.
• Must be willing to work in a compressed workweek. Position is from 6.00pm to 6.00am - Sundays, Monday and Tuesday with alternate Wednesday.
• Must have prior experience working as a technician or experienced operator in a wafer fab environment; working on the typical modules in wafer fabrication
• Requires a High School Diploma or Equivalent with 2 years experience, or AS or BS with some wafer fab experience highly desired.

The full-time base salary range for the Manufacturing Technician II- B Shift position is $29.42 per hour to $34.00 per hour and with a shift differential of 12%. The range reflects the minimum and maximum possible base salary for new hires for the role, based on the advertised location. Individual pay is determined by several factors including work location, job-related skills, experience, and relevant education and training. For more information about the base salary range applicable to the work location, talk to the recruiter. 

Kyocera SLD Laser, Inc. is an equal opportunity employer. We do not discriminate on the basis of race, color, religion, sex (including pregnancy, childbirth, or related medical conditions), gender identity, gender expression, national origin, ancestry, citizenship, age, physical or mental disability, legally protected medical condition, military or veteran status, marital status, domestic partner status, sexual orientation, genetic information, or any other basis protected by local, state, or federal laws.

The above statements are intended to describe the general nature and level of work being performed by people assigned to this job. They are not intended to be an exhaustive list of all responsibilities, duties, and requirements of personnel as classified.