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Job Description:
In this role you will utilize your broad semiconductor packaging experience and partner management experience to drive company’s HPC products from concept to high volume manufacturing. You will be responsible for driving engineering activities with multiple engineering groups such as Packaging, ASIC, AMS, Photonics and external partners to ensure design for manufacturing, reliability, and cost. Responsibilities will include identification and mitigation of risk to new technologies used in product integration and ensure factory readiness through maturing product during the NPI phase. This job will require you to have strong project management, written and verbal communication skills as well as a can-do attitude to prioritize and address issues with a high sense of urgency.
ESSENTIAL DUTIES AND RESPONSIBILITIES:
QUALIFICATIONS:
Location: Bay area location is preferred.
For California location:
As an early startup experiencing explosive growth, we offer an extremely attractive total compensation package, inclusive of competitive base salary and a generous grant of our valuable early-stage equity. The target base salary for this role is approximately $175,000.00 - $200,000.00. The base salary offered may be slightly higher or lower than the target base salary, based on the final scope as determined by the depth of the experience and skills demonstrated by candidate in the interviews.
Full Time
$130k-154k (estimate)
10/07/2023
07/10/2024