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Job Description:
In this role you will utilize your broad semiconductor package layout and design experience in designing package solutions to drive company’s Photonic Fabric family of products from concept to high volume manufacturing. You will be responsible for package design activities with multiple engineering groups, such as Packaging, ASIC, AMS, Photonics and external partners to ensure design for manufacturing, reliability, and cost. This job will require you to have strong project management, written and verbal communication skills as well as a can-do attitude to prioritize and work on projects with a high sense of urgency.
ESSENTIAL DUTIES AND RESPONSIBILITIES:
QUALIFICATIONS:
#LI-Onsite
Full Time
$111k-133k (estimate)
04/13/2024
07/10/2024