Description
The Role
As Mechanical Engineer, you will be responsible for evaluating, ramping, and maintaining CPU package interconnects (2nd- and 3rd-level) such as sockets, interposers, and interfaces and the associated mechanical and electromechanical components using machining, 3D printing and sheet-metal fabrication processes. This position requires developing state-of-the art interconnect socket technologies for the next generation CPU packages with very high I/O count and large body size.
What You'll Do:
•Interface with packaging and platform engineering teams and internal customers in creating the socket "Product Requirement Document" (PRD) to meet all test requirements
•Pull and analyze production yield data
•Perform failure analysis and drive improvements
•Develop interconnect mechanical design concepts, and getting approval from the teams
•Interface with the external socket suppliers as required for failure review, incoming test development
•Evaluate and test prototypes and qualifying sockets for the production build
•Create assembly instructions and providing assembly training to internal and external customers
•Work with suppliers in achieving cost reduction
•Update mechanical documentation and storing models into repositories as needed
•Generate bill of materials (BOM) for assemblies with part numbers
•Design of plastic, sheet-metal and machined parts for low-volume production
•Drive action and closure on manufacturing issues impacting ability to deliver product on time
•Develop solutions to problems utilizing formal education, judgment, and experience
What You'll Bring:
•Minimum 2 years' experience working with semiconductor test systems, automated test (ATE), final test, designing change and/or adapter kits experience in the design and production of high pin count sockets
•Minimum 1 year experience in the design and production of high pin count sockets (preferred)
•Good understanding of the semiconductor packaging design and assembly technologies, design of mechanical and electromechanical subsystems in the electronic industry
•Knowledge and experience in using SolidWorks mechanical CAD and ANSYS finite-element-analysis tools
•Knowledge and experience in designing sheet-metal, machined and plastic parts
•Design for manufacturing techniques skills
•Knowledge and experience of using GD&T to create fabrication drawings
•Creative and effective problem solving skills
•Effective organizational skills to track multiple issues and activities across multiple sites
•Experience working with external suppliers manufacturers
•Knowledge and experience in using power point, Excel and Word
•Knowledge and experience in designing thermals is not a must but preferred
Education:
BSME, MSME, or PhD degree with a minimum of 3 years of experience
Pay and Benefits
Ampere offers a competitive total rewards package that includes base pay, bonus, stock, and comprehensive benefits. The full base pay range for this role is between $106,100 and $176,900. We also offer an annual bonus program tied to internal company goals and annual meritocratic stock awards that enable our employees to participate in the success of the company. Our benefits include health, wellness, and financial programs that support employees through every stage of life, with full benefits eligibility at 20 hours per week. Beyond compensation and benefits, our passionate teams thrive in an inclusive culture that empowers our employees to do more and grow more - all in service of inventing industry leading cloud-native designs that contribute to a more sustainable future. We look forward to sharing more about our career opportunities through interviews.
Our Company
Ampere is designing the future of hyperscale cloud and edge computing with the world's first cloud native processor. Built for the cloud with a modern 64-bit Arm server-based architecture, Ampere gives customers the freedom to accelerate the delivery of all cloud computing applications. With industry-leading cloud performance, power efficiency and scalability, Ampere processors are tailored for the continued growth of cloud and edge computing.
Our Story
Like the scientist behind its name, Ampere employees are innovators. We understand the needs of cloud computing and different software requirements. We are inventing what comes next and looking at everything from the structure of memory and how efficient the system is, to considerations on speed, cost of electricity and ability to cool. Power, size, weight, and cost are driving the technology requirements and the innovation to come.
Our world class team of engineers, with depth and expertise in the cloud and semiconductor industries, is not only focused on the development of new semiconductor designs but also building out the first software ecosystem for Arm®-based server processors. Through the Ampere approach to the cloud and edge, we give our customers the freedom to challenge the status quo and accelerate next-generation data centers for the most memory-intensive applications. Given the challenge we have outlined, we are building a culture of entrepreneurs that ensure customers come first, proactively approaching industry challenges in the areas of security, power, and performance, delivering results that matter most.
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We are an inclusive and equal opportunity employer and welcome applicants from all backgrounds. All applicants will receive consideration for employment without regard to age, race, color, religion, sex, national origin, disability status, protected veteran status, or any other characteristic protected by law.