Are you looking for an opportunity to contribute to a highly motivated team focused on delivering qualified electronic components to a national security mission? The RF Microsystems department (5211) is seeking a mid-career R&D Microwave and Sensor Engineer to design, fabrication, test, qualification and delivery of custom designed microwave components. These components enable military communication systems, SAR imaging and doppler radar, and tagging tracking and locating hardware. Our team is looking for a driven RF engineer capable of fundamental electromagnetic modeling, transistor level circuit simulation, and distributed element microwave PCB design. It is also important to understand electronic die characterization, RF test equipment, working knowledge of solder assembly, PCB development and fabrication.
On any given day, you may be called on to:

• Use circuit modeling tools to design analog or RF integrated circuit components for transceivers including analog, mixed-signal, and RF components.
• Review/Write specifications for radar component design
• Specify fabrication steps to build custom designed printed circuit boards to test integrated circuit components
• Troubleshoot analog or RF circuits in a innovative electronics lab
• Characterize custom designed RF components and modules overvoltage, temperature, and environmental stresses.
• Contribute in developing new ideas and proposals for research activities for the department.
• Use electronic equipment to measure slew rate, gain, stability, phase noise, jitter, s-parameters, power output, P1dB, PSat, noise figure, module

• Master’s in Electrical Engineering or; Bachelor’s in Electrical Engineering plus four (4) years’ experience
• Radio Frequency design experience
• Electrical test and measure practices to protect sensitive devices and equipment to troubleshooting high frequency circuitry
• Use of RF test equipment such as spectrum analyzers, vector network analyzers, pulsed signal generators, oscilloscopes, and precision power supplies.
• Ability to acquire and maintain a DOE Q clearance

• Knowledge of designing distributed element active microwave circuits such as detectors, receivers, and power amplifiers
• Strong written and presentation skills to provide sponsors and vendors convincing evidence of quality designs
• Ability to work independently and within a multi-disciplinary team of peers to meet specifications
• Strong interpersonal skills which include teamwork, effective leadership, negotiation, delegation, and conflict resolution
• Understanding of:
  • fabrication process for printed circuit boards
  • die attaching, wirebonding, and packaging 
  • advanced automated assembly processes for die and very small SMT components
• Strong electrical test and measure skills at the module and die level 
• Experience: 
  • developing complex microsystem solutions including analog, digital, RF, and other technologies 
  • modeling electromagnetic effects on and off die
•  Active DOE Q or DOD TS clearance