Manufacturing Process Engineer II

Job Description:

Supports the development of process technologies and the acquisition, development and qualification of manufacturing equipment for the realization of new products and support of the existing products during the life cycle. Supports the development of continuous improvement processes and oversees the development an implementation of manufacturing processes to achieve operational excellence.

Qualifications:

• Bachelor’s Degree in Engineering (or similar field) with a manufacturing process background.
• Two to five years of experience in electronics (electromechanical) manufacturing, mechanical engineering, mechanical design, manufacturing engineering or related field, working with the design, integration, and manufacturing of RF and Microwave electronic components and assemblies.
• Experience in semiconductor assembly and packaging.
• Experience with mechanical reliability testing and related equipment.
• In-depth knowledge of available assembly processes/technologies such as surface mount, high frequency assemblies, die and wire attach, encapsulation.
• Knowledge of industry standards, PCB technologies, plating processes, adhesive/encapsulant material and solder materials.
• In-depth knowledge of statistical process control and problem-solving techniques.
• Extensive knowledge of manufacturing problem-solving methods.
• Must be a curious and inquisitive self-starter who will take the initiative to conduct research, learn from colleagues and grow within the field.