**This is a direct role with a prestige employer in the defense industry!**
More details about the employer will be shared as you apply and connect with the recruiter.
For this role we have from a level 2 to Senior Principal level openings. Job Summary: The candidate will be responsible for providing innovative design solutions for the packaging of antennas, RF Circuit Card Assemblies, radomes, and RF test equipment. The selected candidate will be expected to lead diverse multidiscipline teams, provide technical oversight, delegate tasks, and work with the Engineering organization to establish technology roadmaps, enable modernization, and contribute to general innovation. In addition, the candidate will work with customer personnel and program leadership to define and refine requirements to validate hardware compliance. The candidate will be responsible for providing guidance, coaching, mentoring, and training to other employees across the business within the candidate’s areas of expertise. This position is an onsite role, located in Tucson, AZ. Responsibilities to Anticipate: Work with others to complete tasks by utilizing your strengths
Develop plans and procedures for solving problems
Proactively communicate task status and results to team members, supervisor, and program
Seek to learn and take on new roles throughout the product life cycle Basic Qualifications: Typically requires a Bachelor’s in Science, Technology, Engineering, or Mathematics (STEM)and a minimum of 2 years of prior relevant experience to include any combination of the following:
Performing design and analysis for the packaging of RF products (e.g. Circuit Card Assemblies, antennas, radomes, RF test equipment, harnesses and interconnects) throughout the product life cycle to include three dimensional (3D) Computer Aided Design (CAD) software
Creation of Technical Data Packages (TDPs) using Geometric Dimensioning and Tolerancing (GD&T) for RF products
The ability to obtain and maintain a U.S. government issued security clearance is required. U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance. Preferred Qualifications: Master of Science (MS) in mechanical engineering or electrical engineering
Experience serving as a Responsible Engineering Authority (REA), Control Account Manager (CAM), and/or Integrated Product Team Lead (IPTL)
Supplier management for built to print or build to specification RF products
Experience creating and presenting professional level design documentation to company leadership and program customers
Creo Simulate or ANSYS Workbench for preliminary structural and thermal analysis of design concepts
Excellent written and verbal communication skills
Failure investigation, root cause identification, and corrective action implementation
Familiarity or direct experience with RF Printed Circuit Board (PCB) material stack ups and Circuit Card Assembly (CCA) layout
One dimensional tolerance analysis for complex mechanical assemblies
Development of technical proposals, engineering project estimates, and/or white papers
Requirements verification test planning and execution