Primary Responsibility is to supportNew Product development and assembly of engineering prototype builds.

Work closely with the Engineering Team on Multi-Chip Module (MCM) assembly and development.
Perform programming, setup and operation ofstencil screen printer, reflow oven, surface mount (FUJI NXTIII), auto die attach (Datacon), Molding (TOWA), marking and dicing saw (Disco)

Create auto wire bond programs and loop profiles in K&S Maxum bonder. Support wire bond process characterization and optimization to achieve desired performance specification. Record and document for repeatability and production readiness.

Responsible for assembly lab equipmentsetup, parameter settings, process verification, and maintenance
Perform manual die pick and placement using tweezers or pickup tools, epoxy / DAF attach on MCMs. The tasks are a combination of manual assembly and equipment operation, involve working with the aid of a microscope and tools for handling very small parts for prototyping.

Support customized build request, mount MCMs on evaluation boards by solder attach. Perform manual soldering, attach passive components, perform rework on boards, change components, mount dies, and wire bonding.

Candidate must be able to work from schematics, diagrams, written and verbal descriptions, layouts or defined plans to perform assembly functions. Candidate must knowhow to interpret builds and BOM (Bill of Material). Must be proficient using hand tools such as tweezers, picks, vacuum pencils. Understanding die bonding, wire bonding, flip chip assembly and test fixtures is also desired.

Candidate should be self-motivated team player with a strong desire to succeed. Must have team-oriented attitude, accountability and ownership.

Job Requirements:
Associatedegree or equivalent years of experience 3 years.

Strong experience in IC assembly process technology, operation and maintenance of assembly tools.

Work from Schematic drawings for assembly builds and follow specifications for qualification of new designs.

Experience with hand tools (e.g., Tweezers, Vacuum pickup tools, Soldering Irons, die handling, test fixtures)

Experience with computers using Microsoft excel, word, power pointand Microsoftoutlook.

Preferred Skills:

Stencil screen print, SMT, reflow, manual die attach, wire bonding, molding, marking, dicing saw, soldering and printed circuit assembly experience, working from engineering drawings, and markups. Trained to handle ESD sensitive electronic components, and experience working with the aid of a microscope.

#LI-MS1