Position Summary:We are looking for a hardworking and passionate Thin Films Process Development Engineer for our Florida Advanced Packaging site. In this role you will lead, develop and improve processes for integrated Advanced Packaging process flows and Heterogenous Integration (HI) platform technologies such as Hybrid Bonding and Direct Bond Interconnect (DBI), 2.5D and 3D Interposer, and Fan-Out Wafer Level Packaging (FOWLP). Excellent oral and written communication skills are required to effectively and efficiently communicate ideas with foundry customers, colleagues, and management.Responsibilities:• Develop or integrate robust manufacturable process recipes for Foundry customers in PECVD and metal thin films deposition (sputtering and e-beam evaporation).• Develop and control thin film processes optimized for product required film stress, thickness, optical properties. • Work in a team for process integration of advanced packaging solutions for platform Heterogenous Integration technologies and unique customer applications.• Utilize metrology tools to characterize and document process results for transfer to production.• Investigate and drive integration changes for improved device performance and yield improvement.• Routinely monitor selected in-line and end-of-line SPC charts for trends or excursions that can be addressed by integration changes.• Act as a team leader or area owner for your unit process modules.The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position.Required Qualifications:Education: BS Engineering, MS/PhD preferred. Physics, Electrical Engineering, Materials Science or equivalent.Experience and Skills:• Back-end-of-line (BEOL) or front-end-of-line (FEOL) fab processing tools knowledge/experience.• 5 years experience with BS, 2 years experience with MS or PhD• MEMS, Photonics, or CMOS device and integration knowledge (or similar) with relevant combination of years of experience and/or advanced degree.• Expert in process development for PECVD dielectrics (silicon oxides and nitrides).• Expert in process development for metal thin films for damascene and TSV (through silicon via) seed layers and pad applications (Cu, Ti, Ta, Al, Au, TiW, etc.) using sputtering, reactive sputtering and e-beam evaporation.• Proficient in DOE and SPC. Knowledge of 6-sigma concepts and applications.• Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes.• Can work both independently and in (or lead) cross-functional teams for problem solving. US Citizenship Required:This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.