What You’ll Do

Principal Engineer, Advanced Packaging Yield Simulation to provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. Mission of the Packaging Solutions Center is to find package solutions beyond Silicon to make next performance systems considering power and cost and to tackle the difficult and hugely innovative task with the industry, focusing on Advanced Packages such as 2.5D, 3D, and 3.5D.

You will be responsible to assess and analyze yield and defect rates for Advanced Packaging technologies, identifying areas for improvement and optimization, related to Samsung’s High-end Advanced Packages, Packaging (ex: SiP, 2.5D, 3D, 3.5D, etc.). This position requires someone comfortable with the many aspects of advanced packaging, and who enjoys the challenge of leading integration driven innovations across geographically disperse teams in pursuit of taking advantage of Advanced Packaging.

Location: Onsite at our San Jose office/headquarters 3-5 days a week with an average of 10% travel per year

Reports to: Corp Executive VP, Packaging Development 

Job #: 41659

• Assess and analyze yield and defect rates for Advanced Packaging technologies, identifying areas for improvement and optimization.
• Apply extensive experience in yield analysis specifically tailored for 2.5D/3D Advanced Packaging solutions.
• Possess comprehensive knowledge and expertise in advanced packaging processes, ensuring a deep understanding of the underlying principles and technologies.
• Utilize strong engineering fundamentals to conduct Mechanical and Thermal analyses, contributing to the assessment and enhancement of packaging designs.
• Demonstrate a strong aptitude for problem-solving, addressing complex issues related to yield and defect management in Advanced Packages.
• Exhibit outstanding written and verbal communication skills, facilitating effective collaboration and knowledge dissemination within cross-functional teams.
• Complete other responsibilities as assigned.

What You Bring

• Bachelors in Electrical Engineering, Mechanical Engineering, Materials Science or Physics with 20 years of experience or Masters in Electrical Engineering, Mechanical Engineering, Materials Science or Physics with 18 Years of Industry Experience or PhD in Electrical Engineering, Mechanical Engineering, Materials Science or Physics with 15 years of Industry Experience Preferred.
• Collaborate closely with manufacturing teams to identify root causes of yield issues and implement corrective actions to optimize production processes.
• Develop and implement advanced statistical models and data analysis techniques to enhance yield prediction and defect management strategies.
• Provide technical leadership in the evaluation and validation of new materials and process improvements to enhance yield and reduce defect rates.
• Collaborate with research and development teams to implement design modifications aimed at improving yield and reducing defects in Advanced Packaging.
• Utilize advanced simulation tools and software for Mechanical and Thermal analyses, ensuring precision and accuracy in assessing packaging performance.
• Participate in cross-functional teams focused on yield and defect reduction initiatives, contributing engineering expertise to drive improvements.
• Stay updated on industry trends and emerging technologies related to Advanced Packaging, incorporating best practices into yield and defect analysis methodologies.
• Contribute to the development of training programs and knowledge sharing initiatives to enhance the skills and capabilities of the engineering team.
• Play a critical role in customer interactions, addressing yield-related concerns, and providing data-driven solutions and recommendations.
• You’re inclusive, adapting your style to the situation and diverse global norms of our people.
• An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding.
• You’re collaborative, building relationships, humbly offering support and openly welcoming approaches.
• Innovative and creative, you proactively explore new ideas and adapt quickly to change.

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