Responsibilities

• Collect, prepare, image, and document the structure and/or composition of nanostructures related to semiconductor devices.

o Manage the queue of samples and cleaving/analysis instructions from the Process Engineering staff
o Lamella preparation using Focused Ion Beam (FIB) tools
o Sample preparation for FIB stub by hand cleave and tweezers
o Transfer Grids to sample holders using tweezers
o Imaging sample features utilizing Scanning Electron Microscopy (SEM], Transmission Electron Microscopy (TEM), Scanning Transmission Electron Microscopy (STEM)
o Collecting compositional feature data utilizing Energy-dispersive X-ray spectroscopy (EDX) and Electron Energy Loss Spectroscopy (EELS)
o Communicating image and compositional results to the Engineering staff

• Development and optimization of sample preparation and analysis techniques
• Train new users on sample Preparation and Analysis Equipment
• Update and maintain Training and certification documents for sample Preparation and Analysis Equipment
• Actively participate and contribute to continuous FIB Operations efficiency improvement
• Possible responsibilities could include in FAB operations

Qualifications

• BS degree in Physical Science or equivalent experience is required
• Previous hands-on experience with FIB and/or STEM/TEM

o Hitachi/ThermoFisher non-automated FIB experience preferred
o ThermoFisher TEM experience preferred
o Hitachi SEM experience preferred

• Experience working in a FAB environment is desired
• The unrestricted right to work in the USA is required

Job Type: Full-time

Salary: Up to $29.00 per hour

Schedule:

• 10 hour shift
• Day shift
• Evening shift
• Monday to Friday
• Morning shift
• Night shift
• Overnight shift

Experience:

• FAB environment: 2 years (Required)
• FIB and/or STEM/TEM: 3 years (Required)

Work Location: In person