Micross Advanced Interconnect Technology is seeking a knowledgeable, self-motivated physical science or engineering student for an internship with our Process Engineering team. The internship will require extensive hands-on wafer processing in our cleanroom facilities with the successful candidate performing any of the following: wet processing, thin film depositions (sputter, e-beam, and/or PECVD), dry etching, and electroplating. The successful candidate should have some knowledge of wafer processes and basic device processing steps. Experience with material characterization, metrology measurements, data recording, and data presentation/summation is a plus.

This is a spring internship that can be extended into the summer.

25 hours a week maximum.

Other Duties & Responsibilities:

• Comply with all safety policies, practices and procedures.

• Comply with all quality and ITAR policies, practices and procedures;
• Participate in proactive team efforts to achieve departmental and company goals;
• Contribute to building a positive team spirit;
• Communicate effectively with all levels of employees;
• Protect confidential information by not communicating, disclosing to, or using for benefit of 3rd parties.
• Perform other related duties as assigned