Northrop Grumman MS engineers share a great sense of pride knowing their contributions have a direct effect on the safety and security of the country and its allies. Our culture thrives on intellectual curiosity, cognitive diversity, teamwork, and bringing your whole self to work to accomplish the mission while learning and having fun along the way. The Airborne Multifunction Sensors Engineering and Sciences (AMS E&S) organization is fertile ground for all experience levels to become part of our growing team and contribute to our goals. The department offers opportunities to grow on a technical track both broad and deep as well as explore project leadership or management positions.

AMS E&S is seeking engineers with experience and interest in electronic assembly and packaging design including:

• Designing, modeling, and verifying RF, microwave, and mixed signal subsystem assemblies
• Utilize analysis, simulations, and prototyping to develop antenna designs including phased arrays
• Deriving and trading requirements with subsystem engineers and component level designers
• Managing RF budgets, frequency planning, and common assembly level interfaces
• Predicting assembly level performance through selecting materials, components, and packaging approaches, RF chain analysis, electromagnetic simulation, data collection and analysis, and other modeling techniques
• Working directly with component level design peers developing custom RF integrated circuit designs to meet assembly-level requirements
• Collaborating with peer functions such as Mechanical, Manufacturing, Quality, Supply Chain, and Test
• Utilizing world class manufacturing capabilities both on-site and within the broader company for prototyping through full rate production from the foundry level to microelectronic packaging to printed circuit board fabrication and assembly to subsystem level integration and test
• Working directly with a wide variety of different external supplier partners including leading domestic foundries, printed circuit board fabricators and assemblers, component manufacturers, material fabricators, and more
• Supporting products throughout the product life cycle
• RF and mixed signal product types include antenna radiators, circulators, device interposers, filters, manifolds, receiver / exciter assemblies, signal conditioning assemblies, signal generators, and transmit / receive assemblies

This is an on-site position located in Linthicum, MD with easy access to the major cities of Baltimore to the north and Washington DC to the south. The location is a 2-hour drive to the Atlantic Ocean to the east or the Appalachian Mountains to the north and west. The area is rich with historical sites, museums, concerts and performing arts venues, one of the nation’s top medical facilities, college and professional sports, nightlife, and many outdoor activities most notably boating and fishing on the Chesapeake Bay. The Linthicum campus includes the potential to live in urban, suburban, and waterfront communities within easy commutes and is conveniently located adjacent to the BWI International Airport and an Amtrak rail station.

Principal Engineer Basic Qualifications:

• Electrical Engineering or related STEM field degree: Bachelor of Science with 5 years of RF/microwave experience; Master’s degree with 3 years of RF/microwave experience; or PhD degree
• Ability to provide solutions to a broad variety of RF/Microwave design and test related problems of complex difficulty. Solutions are imaginative, thorough, and practical.
• Developing subject matter expertise in one or more areas of RF/Microwave discipline including but not limited to: RF components & assemblies, requirements development, EM and related modeling & simulation, RF test verification, production test support, and design for producibility
• Exhibit intermediate to expert proficiency with industry standard RF/Microwave modeling, simulation and printed circuit board design tools (i.e. ANSYS HFSS/Maxwell, CST Microwave, Eagleware/Genesys, Keysight ADS, Xpedition, Altium, FEKO, TICRA)
• US Citizenship is required
• Proven knowledge of electrical engineering design software and equipment
• Effective verbal and written communication skills
• Productive in a team working environment
• Must obtain interim secret (minimum) prior to starting
• AMC Advanced Program Award prior to candidate starting

Senior Principal Engineer Basic Qualifications:

• Electrical Engineering or related STEM field degree: Bachelor of Science with 9 years of RF/microwave experience; Master’s degree with 7 years of RF/microwave experience; PhD degree with 4 years of experience
• Ability to develop solutions to a broad variety of RF/Microwave design and test related problems of complex difficulty which require the regular use of ingenuity and creativity
• Established subject matter expertise in one or more areas of RF/Microwave discipline including but not limited to: RF components & assemblies, requirements development, EM and related modeling & simulation, RF test verification, production test support, and design for producibility
• Exhibit expert proficiency with industry standard RF/Microwave modeling, simulation and printed circuit board design tools (i.e. ANSYS HFSS/Maxwell, CST Microwave, Eagleware/Genesys, Keysight ADS, Xpedition, Altium, FEKO, TICRA)
• US Citizenship is required
• Proven knowledge of electrical engineering design software and equipment
• Effective verbal and written communication skills
• Ability to design, implement, install and maintain electrical systems
• Technical Team Leadership
• Must obtain interim secret (minimum) prior to starting
• Access AMC Advanced Program Award prior to candidate starting

Preferred Qualifications for both Principal and Senior Principal roles:

• Secret or Top Secret / SCI security clearance
• RF and mixed signal printed circuit board and circuit card assembly level design
• RF budgeting, frequency planning, RF chain analysis and modeling, schematic capture, electromagnetic simulation, signal integrity analysis
• Component selection and/or custom component requirements flow down and trades
• Ceramic and organic printed circuit board materials, design, fabrication, and assembly processes
• Integrated Circuit packaging techniques including chip-and-wire, QFN, flip-chip
• RF lab equipment such as network analyzers, spectrum analyzers, signal generators, power meters, etc.
• Electronic troubleshooting from component to assembly levels
• Complex data reduction and analysis
• Product life cycle support from concept through production support
• Designing for high reliability, mil/aero requirements and environments
• AESA / phased array, Radar, SIGINT, or SATCOM experience
• Technical team leadership
• Experience in the Aerospace or Defense Industry
• Software tools: Mentor Xpedition DX Designer, ANSYS HFSS, Keysight ADS, Keysight Genesys, MathWorks MATLAB, Autodesk AutoCAD, and Microsoft Office Suite (Excel, PowerPoint, Project, Word)