Job Knowledge, Skills & Abilities :

• Perform general physical activities.
• Monitor processes, materials and surroundings.
• Minimum 1 year working experience as a manual die attach / sub-attach operator in a microelectronic assembly factory.
• Familiar with MIL-PRF-38534 requirements for microelectronics’ assembly.
• Ability to work in a class 100,000 (class 8) clean room environment using clean room antistatic gowns, facemasks, hair covers etc.
• Ability to work with a 30X microscope throughout the day.
• Ability to work in manufacturing area with normal factory noise levels.
• Ability to work on a team and be a good team member.
• Should not have a problem in using chemical based cleaning systems for cleaning build substrates etc.
• Sense of urgency, successful at meeting deadlines.
• Mechanical aptitude / dexterity and the ability to lift up to 20 lbs
• Fluency in English Language- Reading, written & spoken Education / Experience :
• High School Diploma / GED or equivalent experience
• Valid Permanent Resident or citizen of the United States of America Due to ITAR and / or CUI compliance, this position requires candidates to be a U.
• S. Citizen, Permanent Resident Alien, or Protected Individual per 8 U.S.C.1324b(a)(3). Benefits Offered : Comprehensive benefit package including medical, dental and vision coverage;

company-paid basic life / AD&D insurance, short-term and long-term disability insurance; voluntary supplemental insurances, flexible spending accounts and employee assistance program (EAP).

Sick Leave, Vacation Time, and company-paid Holidays are also provided as paid time off. NEOTech also provides a 401(k) Retirement Savings Plan option with a company match.

NEOTech is an Equal Opportunity / Affirmative Action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex including sexual orientation and gender identity, national origin, disability, protected Veteran status, or any other characteristic protected by applicable federal, state, or local law.

NEOTech has a long-standing commitment to maintaining a safe, quality-oriented and productive work environment. We also want all employees to perform their duties safely and efficiently, in a manner that protects their interests and those of their co-workers.

We recognize that alcohol and drug abuse pose a threat to the health and safety of NEOTech employees and to the security of the Company’s equipment and facilities.

For these reasons, NEOTech is committed to the elimination of drug and alcohol use and abuse in the workplace. Candidates being considered for hire must pass a pre-employment background check and drug test which include screening for illegal drugs and marijuana.

Summary : Manual placement of components in a clean-room environment, to manufacture high-reliability microelectronic devices.

Essential Duties and Responsibilities :

• Read and interpret assembly instructions, drawings and work instruction processes.
• Written tests for ESD Manual Die attach and Sub Attach requirements.
• Use tools such as fine tipped tweezers, x-acto knives, vacuum pencils, dental probes, calipers, scales.
• Handle fine pitched micro electronics components such as dies, air-bridge dies, capacitors, resistors, substrates, hybrids.

In addition handle epoxy and cut performs for the purpose of assembly of the above mentioned components. Knowledge of how to open and close die waffle packs and handle air-bridge die gel packs.

• Hand apply epoxy and solder on densly populated substrate pads without disturbing epoxy on neighboring pads.
• Manually place above mentioned components on substrates without disturbing neighboring wet assemblies.
• Attach loaded / unloaded substrates into case using performs and hot plate.
• Work with sikama reflow equipment and ovens.
• Use hot plates and other tools to remove dies and other components from the substrate for the purpose of rework.
• Perform rework- removing epoxy, die and other components from the substrate and applying fresh epoxy and installing new components using the above mentioned tools, hot plate etc.
• Inspect - to the prints and procedures the epoxy placement, microelectronics component assembly and substrates for defects before starting the assembly and after finishing his / her part of the assembly.
• Adhere to all ESD and other handling requirements.
• Comply with all in-house training as identified in job specific family and or specific training plan.
• Follow company 6S and continuous improvement (kaizen) objectives.
• Perform all other duties, as assigned.

Last updated : 2024-03-26