As a process integration engineer in the 3D DRAM organization, you will be part of a team of world-class engineers who are working in an industry leading 300mm R&D facility on technology which enables future memory scaling. You will focus on the performance and manufacturability of Micron’s cutting-edge next-generation memories. Areas of concentration will include integration and circuit issues specific to 3D DRAM technology. In addition to a broad basis of process integration knowledge, this position will require a strong background in semiconductor device physics. Role interacts significantly with the process development, simulation, modeling, characterization, and reliability groups. 

Responsibilities include, but not limited to:

• Lead technology integration activities in enabling manufacturability of state-of-the-art 3D DRAM technology, working on device components such as charge storage devices and thin-film transistors (TFTs), among others.

• Engage with numerous cross-functional teams including process development, product engineering, design, yield improvement, advanced mask and probe to arrive at solutions to yield and margin issues

• Design and handle experiments in the R&D fab

• Optimize process flows and develop creative solutions to meet product requirements.

• Extract, supervise, analyze, and react to inline data, defect data, param data and probe data to fix yield issues, performance, reliability, add process margin and reduce costs.

• Lead / participate in continuous yield improvement and cost reduction activities.

• Summarize sophisticated problems, derive, explain actions taken to address them and drive team to implement them.

Qualifications:

• You have a detailed knowledge of mainstream memory technologies such as DRAM, NAND, etc. acquired through significant proven contributions.

• You are an expert in semiconductor device physics.

• You have strong understanding of semiconductor process integration and process development.

• You understand the challenges and opportunities facing alternative memory technologies is encouraged.

• You are very familiar with both process integration & circuit/architecture issues as they relate to memory.

• You are proficient with data analysis, DOE, and statistical techniques.

• You have proven project management skills and experience driving cross-functional technical teams.

Education:

• M.S. or PhD with 5 years of industry experience.