You haven't searched anything yet.
Intel's Advanced Packaging (AP) technologies extend and drive Moore's Law as the company aspires to a trillion transistors in a package by 2030. Intel has led the industry in disaggregated advanced packaging for a couple of decades. Its innovations include EMIB (embedded multi-die interconnect bridge) and Foveros, technologies that allow multiple chips on a package to be connected side by side (EMIB) or stacked on top of one another in a 3D fashion (Foveros).
The Disaggregated Manufacturing Organization (DMO) develops fab processes for Foveros base silicon interposer and embedded multi-die interconnect silicon bride (EMIB) architectures to enable both internal and Foundry AP future roadmaps.
The DMO EMIB/Silicon Interposer TD Process Champion will be the interface between the DMO TD Org and Process Module Teams in Fab/Assembly to meet TD Program Deliverables.
Responsibilities include the following:
- Collaborate across ATTD, LTD, ATTD, FEC, and IFS orgs to develop fab processes that efficiently meet overall AP Program needs through technology certifications.
- Drive fab process readiness (PRI) activities from concept through HVM ready milestones including alignment of technology-enabling equipment selections with target spec definition, technology cost roadmap development, and manufacturability.
- Understand interactions of fab processing (ex: warpage, scribe layout) with various developing assembly processes to enhance overall development cadence for future roadmap offerings.
- Coordinate resourcing across teams to ensure milestones are on track to meet the development timelines of several programs progressing in parallel.
- Develop roadmaps to meet new technology requirements across process modules.
The ideal candidate will exhibit the following behavioral traits:
- Clear communication across various organizations and levels.
- Demonstrated ability to drive cross-organizational teams to deliver program deliverables.
- Drive solutions to technology challenges as they arise while maintaining delivery of overall program deliverables.
- Creativity and flexibility to address the emerging challenges of AP through strong cross-team collaboration while maintaining data-driven and constructive work environments.
- Develop a growing pipeline of individuals, managers, and teams to continue to drive Intel's current and future AP roadmaps.
Minimum Qualifications
Masters in an Engineering or Physics/EE/Chemistry/Material Science related field.
15 years direct experience in process development or integration of semiconductor devices
Preferred Qualifications:
PhD in an Engineering or Physics/EE/Chemistry/Material Science related field.
10 years of experience in semiconductor process development as a process engineer, process integrator or technical program manager.
-Prior experience as a Process Champion or Program Manager
-Prior Assembly (wafer/package) process development and/or integration experience
-Prior Fab process development and/or integration experience
Other
Semiconductor
$97k-112k (estimate)
04/27/2024
06/26/2024
intel.com
SANTA CLARA, CA
>50,000
1968
Public
PATRICK GELSINGER
>$50B
Semiconductor
Intel is a California based technology company that designs and builds processors, motherboards, electronic disk, storage devices and mobile chips.