Position Title: Second Op Operator All Levels

Reports To: Production Manager

Location: Silicon Valley

FLSA Status: Non-Exempt

POSITION SUMMARY

Use microscope equipment to perform visual inspection of die and other components by following standard and customized requirements per customer requests. Categorize defects follow standard or customized specification.

KEY RESPONSIBILITIES/ESSENTIAL FUNCTIONS INCLUDE:

Level 1:

• Perform visual inspection on die based on commercial and military criteria per customer’s request. If discrepancies are found, initiate discrepancy report (DR) and turn them to DR coordinator.
• Track documents and jobs in real time basis and enter data into Epicor system. Ensure data recording on lot travelers is accurate.
• Understand the difference between Good and Reject die reporting, specify proper reject coding
• Perform die sidewall inspection by following guidelines in specified criteria
• Perform re-inspection job after discrepancy report released for low yield
• Perform die plate monitor and inspection of die devices.
• Meet 95% yield requirement or better at QC sample inspection.
• Identify and report process deviations to supervisor.
• Meet quality goals, safety requirements, and follow company policies.
• Flexibility to perform other duties as assigned.

Level 2:

• Perform visual inspection on die devices in compliance with military criteria
• Back fill die on cavity that need to be reinspected, stack of waffle pack with good and bad dies and record in summary report before submitting job to Quality Control
• Perform backside inspection based on customer specifications
• Perform INP inspection on die based on INP criteria
• Perform flip die in bump die per customer specifications
• Meet or exceed daily output of 200 die per hour and 95% yield requirement or better at QC sample inspection.
• Identify and report process deviations to supervisor.
• Meet quality goals, safety requirements, and follow company policies.
• Flexibility to perform other duties as assigned.

Level 3:

• Perform visual inspection of 100x or higher in magnifications for verification of defects of die devices.
• Understand many different rules and exceptions on different die devices for visual inspection.
• Understand all criteria both hermetic and non-hermetic for inspection
• Perform visual inspection in device specifications to the GaAs visual document. Be able to identify different die devices by the string near the edge.
• Perform visual inspection back side and front side for Totsuka dies.
• Perform visual inspection & inking wafer to Totsuka
• Use X-ray machine to handle die orientation for accuracy
• Responsible to operate machine using Camtek tool for wafer inspection. Review defects found per customer specs. Understanding the editing and reclassification of wafers.
• Meet or exceed 95% yield requirement or better at QC sample inspection.
• Identify and report process deviations to supervisor.
• Meet quality goals, safety requirements, and follow company policies.
• Flexibility to perform other duties as assigned.

Level 4:

• Perform visual inspection of 100x or higher in magnifications for verification of defects of die devices.
• Understand many different rules and exceptions on different die devices for visual inspection.
• Understand all criteria both hermetic and non-hermetic for inspection
• Perform visual inspection in device specifications to the GaAs visual document. Be able to identify different die devices by the string near the edge.
• Use X-ray machine to handle die orientation for accuracy
• Responsible to operate machine using Camtek tool for wafer inspection. Review defects found per customer specs. Understanding the editing and reclassification of wafers.
• Meet or exceed 95% yield requirement or better at QC sample inspection.
• Identify and report process deviations to supervisor.
• Meet quality goals, safety requirements, and follow company policies.
• Flexibility to perform other duties as assigned.

Lead:

• Serve as back-up team leader and perform operator pass down at shift change
• Responsible for inventory, material requests and hands-on job execution to ensure on time delivery
• Verify machine setup and update department schedules
• Provide on-the-job training for new operators

JOB REQUIREMENTS INCLUDE

Education: High school diploma or equivalent required.

Experience: Minimum one year experience with semiconductor production test

Knowledge/Skills:

• Familiar with procedure of wafer and die
• Familiar with devices wafer, wafer maps, die location, multi-die ID, small and thin die, big die, bump die
• Experience with hand tools such as tweezers, vacuum, pickup tools, die handling

SUPERVISORY RESPONSIBILITIES

Total Number of Employees Directly Supervising: _0__

Number of Subordinate Supervisors Reporting to Position: _0__

This job description is intended to describe the general nature and level of work being performed. This is not intended to be an all-inclusive list of responsibilities, duties, skills required of employees so classified.

In addition, this is not an employment contract and should not be construed or interpreted as creating an implied or expressed guarantee of continued employment. The employment relationship at Integra Technologies Inc is by mutual consent (Employment at Will).