We are seeking a entry-level Wafer Coating Process Engineer to join our growing team. You will be primally responsible for spin-coating and annealing based thin film deposition, characterization, wafer dicing and polishing. Ideal candidate must possess knowledge and experience of spin-coating process, logical thinking, communication skills, team-working, flexibility and “can-do” attitude.

Primary Responsibilities will be a couple of processes below.

• Spin-coating
• Thin film annealing
• Thin film characterization
• Wafer dicing
• Chip edge polishing

Education and Experience

• Education requirement: Preferred with an AA, BS or higher in technical field.
• Experience requirement: over 1 years in wafer handling process with tweezers.
• Preferred experience: Knowledge and/or experience in spin-coating and chemicals.
• Candidate must be highly motivated and organized.