You haven't searched anything yet.
Please Note:
1. If you are a first time user, please create your candidatelogin account before you apply for a job. (Click Sign In > Create Account)
2. If you already have a Candidate Account, please Sign-In before you apply.
Job Description:Work with Business Units chip design team & Analog / Digital IP / Phy owners (e.g. 224G PAM4, 112G PAM4, HBM3/4) for new advanced node silicon (5nm, 3nm, 2nm..) chip floor plan & IP bump pattern design and optimization for package design requirements (e.g. layer-count, stack-up, escape architecture, BGA pattern development, s-parameter extraction/comprehension and optimization [RL, NEXT/FEXT, IL etc.], and power integrity [PI] requirements)
Work with business unit marketing and IC design teams to select the optimum package solution on cost, performance, manufacturability, and reliability for new advanced silicon node products monolithic, 2.5D & Co-Packaged Optics (5nm, 3nm, 2nm and beyond)
Job Requirements
Familiarity with advanced technologies such as 3D patterned structures such as inductors in package substrate, embedding etc. are
Additional Job Description:
Compensation and Benefits
The annual base salary range for this position is $111,000- $185,000
This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Broadcom Inc. is committed to creating a diverse work environment and is proud to be an equal opportunity employer.Full Time
Semiconductor
$159k-195k (estimate)
05/21/2024
06/01/2024
broadcom.com
SAN JOSE, CA
15,000 - 50,000
1991
Public
HOCK E TAN
$10B - $50B
Semiconductor
Broadcom is a fabless semiconductor firm that provides solution for wired and wireless communications.
The job skills required for Principal Engineer include Leadership, Project Management, Integrity, etc. Having related job skills and expertise will give you an advantage when applying to be a Principal Engineer. That makes you unique and can impact how much salary you can get paid. Below are job openings related to skills required by Principal Engineer. Select any job title you are interested in and start to search job requirements.
The following is the career advancement route for Principal Engineer positions, which can be used as a reference in future career path planning. As a Principal Engineer, it can be promoted into senior positions as a Biomedical Engineering Supervisor I that are expected to handle more key tasks, people in this role will get a higher salary paid than an ordinary Principal Engineer. You can explore the career advancement for a Principal Engineer below and select your interested title to get hiring information.