Amkor Technology is hiring a Wirebond BGA (WBBGA) Product Manager in our corporate offices, located in Tempe, AZ. The primary function of the position is to develop and drive business strategies which increase revenue and gross margin of the WBBGA package family. In addition, the Product Manager will coordinate with sales, multiple off-shore manufacturing sites, and R&D to set the technical direction for the package family. Also, the candidate will support the new product development, qualification and mass production for the WBBGA package family. This individual will need to help define and concurrently manage multiple programs through internal management systems, as well as identify and develop new customers. This is an individual contributor role that is highly cross-functional.

• Set and drive business strategy as part of the WBBGA product line.
• Drive new technical developments through R&D in support of the WBBGA business strategy.
• Manage sales and customer relationships and gain intimate understanding of customer market and OSAT strategy to grow market share.
• Manage individual customer programs and technical issues to resolution through close collaboration with Sales and Factory site.
• Promote Amkor Technology to find potential applications and deploy the packaging portfolio.
• Align cost reduction activities, standardization, and system/process enhancements with manufacturing sites and customers.
• Prepare and communicate technical marketing materials to sales and customers.
• Develop an understanding of key competitors and their business/market strategies.
• Coordinate with factory planning to drive appropriate levels of capacity, with financial justification, to meet customer demand.
• Provide technical review of NPI products along with other members of the Business Operation team.
• Review quality incidents and associated reports to ensure accuracy and provide feedback to factories and sales teams.
• Guide Amkor Technical Program Managers to identify and communicate to customers WBBGA product solutions.

QUALIFICATIONS:

• This position requires a Bachelor's Degree in Engineering (materials science, mechanical engineering, microelectronics or similar).
• Minimum of 10 years of relevant experience, with at least 2 years of Product/Project Management experience.
• Packaging Assembly Process technologies background/knowledge required, building Wirebond or Flipchip packages highly preferred.
• Highly organized, possess keen attention to detail, possess sense of urgency, and able to successfully manage projects and people not under one's direct authority.
• Ability to communicate at all levels within Amkor and customer organizations.
• Posses an intermediate level of financial analysis understanding and capability, including NPV and ROI analysis.
• Knowledge of material and package characterization data analysis, test methods and automotive qualification procedures is desired.
• Prior product management experience involving off-shore factory assets and the ability to multiplex across numerous programs and teams is essential.
• Demonstrated ability to work independently in a heavily matrixed organization and have experience with design and manufacturing systems used in wirebond packages.
• Demonstrated ability to multi-task with excellent communication (written and verbal) and presentation skills, working across functional groups as well as cross-culturally.
• Ability to deliver technical presentations for customers and at industry seminars.
• Previous experience with AutoCAD or similar software for review of technical package level designs.
• This position requires approximately 20% domestic and 10% international travel.
• Experience with automotive requirements for semiconductor packaging is a plus.
• Working knowledge of SAP applications is desired.
• Manufacturing experience with wirebond products is preferred.
• Analytical experience for cost structures is beneficial.
• Experience with market growth strategies is a plus.
• Prior experience with P&L management is preferred.