2 Microelectronic Packaging Mechanical Design Engineer (Linthicum, MD) Jobs in Linthicum, MD

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Microelectronic Packaging Mechanical Design Engineer (Linthicum, MD)

Advanced Sciences and Technologies (AS&T)

Linthicum, MD | Full Time

$89k-106k (estimate)

5 Months Ago

Principal Mechanical Electronic Packaging Engineer/Senior Principal Mechanical Electronic Packaging Engineer (Linthicum, MD)

Advanced Sciences and Technologies (AS&T)

Linthicum, MD | Full Time

$147k-181k (estimate)

5 Months Ago

Microelectronic Packaging Mechanical Design Engineer (Linthicum, MD)

$89k-106k (estimate)

Full Time 5 Months Ago

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Advanced Sciences and Technologies (AS&T) is Hiring a Microelectronic Packaging Mechanical Design Engineer (Linthicum, MD) Near Linthicum, MD

Overview: You will work as part of a cross-functional team that is responsible for the design and development of cutting-edge AESA antenna hardware, that are fielded on a multitude of airborne, marine, ground-based, and space military platforms. You'll support multiple projects spanning the product lifecycle, from R&D to full-rate production. As an integral part of the Engineering and Sciences team, you will be responsible for the design and development of cutting-edge AESA antenna hardware.Roles and Responsibilities include:

Design, prototyping and production support of state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies
Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management and manufacturing.
Organizing and prioritizing tasks in order to accomplish project milestones within schedule and budgetary constraints.

Basic Qualifications:

Bachelor’s degree with 2 years of experience, a Master’s degree with 0 years of experience or a PhD with 0 years of experience in Mechanical Engineering, Electrical Engineering, or closely related technical fields.
U.S Citizenship
The ability to obtain/maintain an active DoD Secret Clearance
Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate/PWB layout
Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs
Proficient with AutoCAD
Familiarity with NX or other 3D modeling software

Preferred Qualifications:

Active DoD Secret Clearance or higher
Proficiency with ASME Y14.5 geometric dimensioning and tolerancing (GD&T) and ASME Y14.100 engineering drawing practices
Familiarity with thermal and structural analysis considerations, methodologies, and software tools
Experience with hands-on assembly and testing of prototype electronic hardware
Experience in a technical role on a cross-functional product development team