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Idaho State Job Bank
Boise, ID | Full Time
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Micron Technology
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CMP Process Development Engineer - Packaging
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$95k-111k (estimate)
Full Time 3 Days Ago
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Idaho State Job Bank is Hiring a CMP Process Development Engineer - Packaging Near Boise, ID

CMP Process Development Engineer - Packaging at Micron Technology, Inc. in Boise, Idaho, United States Job Description Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a CMP packaging process engineer within our Technology Development organization at Micron Technology, you will be part of a world-wide advanced packaging team responsible for next generation high bandwidth memory (HBM) pathfinding and development. You will be responsible for developing CMP process technology which will enable Micron to develop cutting edge memory technology. As a Process Engineer you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. Additional responsibilities include coordinating and carrying out process, equipment and material evaluation/optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with material suppliers to achieve quality, cost and risk management objectives. Responsibilities include, but not limited to: Drive design of experiments (DOEs) and analysis with tenacity in creating a process technology path towards definition of leading HBM products in the market Collaborate with cross functional teams for demonstration and development of advanced packaging technology Engage with external vendors and research partners in expediting the process development schedule Model-based problem solving and drive innovation efforts through risk/ issues mitigation, patents, and papers Identify, diagnose and resolve assembly process related problems Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step Lead / participate in continuous yield improvement and cost reduction activities Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduc To view full details and how to apply, please login or create a Job Seeker account

Job Summary

JOB TYPE

Full Time

SALARY

$95k-111k (estimate)

POST DATE

06/13/2024

EXPIRATION DATE

06/28/2024

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