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Process Engineer - Thin films

Job Description

Driving success happens daily here. Tokyo Electron America, Inc. employees foster strong partnerships with TEL's US customer base. We market a wide range of semiconductor production equipment (SPE) products and provide outstanding service and support to U.S. semiconductor device manufacturers. TEL's world-renowned products and technologies support diverse customer needs for the manufacture of increasingly sophisticated semiconductors.Position Summary:
Provide process development support for the introduction and growth of new technologies at a customer site. Responsibilities:
* Development of new or modified process formulations, definition of processing requirements and specifications, review of processing techniques and methods applied in the manufacture, fabrication and evaluation of semiconductors
* Support customer engineering and facilitatecustomer communication to ensure metrics are defined, key activities are aligned and progress is made .
* Work with customer and factory to design and execute experiments to demonstrate hardware and process performance

* Operate and understand deposition hardware functionality as it can relate to thin film properties

* Compile and evaluate test data using various statistical techniques to establish system baselines, report on productivity, identify paths for improvement and create concise reports.
* Effectively document,communicate, and work to resolve issues with our factory engineering staff in Japan.
* Work closely with other process, technical support and field service elements to install, start-up, trouble shoot and improve TEL products.
* Interact with sales, marketing, and other cross functional teams to understand customer needs, promote TEL products, and identify areas for future applications growth. Qualifications:
* BS degree in Material Science, Chemistry, Chemical Engineering, or other equivalent Science/ Engineering, MS or PhD preferred.
* 2 years of experience working in the semiconductor industry or relevant area is required.

* Experience with CMOS,NAND, DRAM or other semiconductor device manufacturing preferred.* Previous ALD, CVD, PECVD, PE-ALD or other thin films deposition experience is preferred

* Understanding of characterization and surface analysis techniques like TEM, XRD, XPS, SIMS, Ellipsometry, AFM, and others preferred.
* Understanding and working experience of statistics for Hypothesis Testing, SPC, and DOE.
* Project management experience or having previously demonstrated a strong self-directed skill set is preferred.
* Excellent verbal and written communication skills a must
* Ability and desire to work in a multicultural team
* Ability for some domestic or international travel Physical Requirements:
Job duties may be performed in confined areas in a clean room environment, in awkward positions and/or in high places. Mechanical aptitude, manual dexterity and ability to lift/carry objects up to 35 pounds may be required. May require bending/stooping/crawling/climbing. May require the use of Personal Protection equipment and proper industry safety procedures when working with one or more dangerous element or conditions such as chemicals, electric currents or high voltage, moving mechanical parts, radiation, etc. Occasional overnight travel to TEL factory, training facilities and customer locations may be required.
Equal Opportunity Employer/Minorities/Females/Disabled/Veterans

Diversity creates an innovative culture. TEL US is an Equal Employment Opportunity / Affirmative Action employer and all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, age, national origin, protected veteran status, disability status, sexual orientation, gender identity or expression, marital status, genetic information, or any other characteristic protected by law.