What are the responsibilities and job description for the Director of Module Development position at Xscape Photonics Inc?
Role Overview
We’re looking for a senior leader to drive Module Development for next-generation ELSFP external laser modules. This person will own the full development of highly integrated modules that bring together PCB electronics, photonics, packaging, and thermal design into a product that can scale in manufacturing.
The role requires leading cross-functional engineering teams to deliver high-performance, low-noise, and thermally stable laser modules from early concept through volume production, while also shaping the architecture and development path for future generations.
Key Responsibilities
Module Architecture & Development
- Own end-to-end module development, including:
- PCB design for laser drivers, TEC control, and monitoring circuits
- Optical subassemblies and laser integration
- Mechanical packaging and thermal design
- Define overall module architecture and make design trade-offs across performance, cost, power, and manufacturability
- Drive tight optical, electrical, and thermal co-design within ELSFP constraints
Engineering Leadership
- Build and lead a multidisciplinary module development team across:
- PCB / electronics
- Mechanical / thermal engineering
- Test and validation
- Set technical direction, lead design reviews, and maintain a high bar for execution
- Establish strong practices for design, integration, debug, and validation
Execution & Delivery
- Drive development from prototype through qualification (EVT/DVT/PVT) and production ramp
- Partner closely with TPM and operations to deliver on schedule
- Own key module metrics including noise, stability, yield, reliability, and cost
PCB & Electronics
- Oversee development of low-noise, high-performance PCBs that are critical to laser stability
- Ensure strong power integrity, signal integrity, and EMI performance
- Guide integration of:
- Laser drivers
- TEC controllers and thermal feedback loops
- Photodiode sensing and control systems
Manufacturing & Supply Chain
- Define module assembly flow, test strategy, and calibration processes
- Work closely with CMs, ODMs, and suppliers on:
- PCB fabrication and assembly
- Laser and optical component sourcing
- Module packaging and alignment
- Drive DFM/DFT, yield improvement, and cost reduction
Reliability & Quality
- Ensure compliance with reliability and qualification requirements
- Lead failure analysis and root-cause resolution across module and PCB-related issues
Required Qualifications
- BS or MS in Electrical Engineering, Photonics, Physics, or a related field
- 12–15 years of experience in optical modules or other complex hardware systems
- 5 years of leadership experience in module, subsystem, or product development
- Strong technical depth in:
- PCB design, including mixed-signal, low-noise, PI/SI considerations
- Module and system integration
- Proven track record of bringing hardware products into volume production
Preferred Qualifications
- Experience with ELSFP, QSFP-DD, CFP2, or similar optical modules
- Background in tunable or coherent laser systems
- Familiarity with:
- TEC-based thermal control
- Optical packaging and alignment
- Stabilization control loops and supporting firmware
- Experience working in startup or fast-scaling environments