What are the responsibilities and job description for the Technical Program Manager – Module Development position at Xscape Photonics Inc?
We are seeking a highly driven Technical Program Manager (TPM) to lead execution of design and module-level development for ELSFP external laser modules. This role sits at the intersection of hardware engineering, photonics, packaging, and manufacturing, driving complex programs from concept through volume production.
You will ensure tight coordination across cross-functional teams to deliver high-performance, low-noise, thermally stable laser modules on schedule and at scale.
Key Responsibilities
- Own end-to-end program execution for PCB and module development:
- Planning, scheduling, risk management, and milestone tracking
- Prototype builds → EVT/DVT/PVT → production ramp
- Drive alignment across teams:
- PCB (analog/mixed-signal design, layout)
- Photonics/laser engineering
- Mechanical/thermal design
- Firmware and controls
- Test and validation
- Manage critical design dependencies:
- Laser driver TEC control integration
- Power integrity, noise, and thermal constraints
- Optical-electrical-mechanical co-design within ELSFP form factor
- Identify and mitigate technical and schedule risks, especially around:
- Noise performance impacting coherent systems
- Thermal stability and wavelength control
- Vendor/component lead times
- Coordinate with vendors, CMs/ODMs, and supply chain for:
- PCB fabrication and assembly
- Laser and optical component sourcing
- Module assembly and test
- Drive bring-up and validation execution:
- Track issues, debug progress, and closure
- Ensure coverage across electrical, thermal, and optical performance
- Ensure DFM/DFT readiness, yield targets, and cost goals are met for production
Required Qualifications
- BS/MS in Electrical Engineering, Physics, or related field
- 8–12 years of experience in hardware program management or system engineering
- Strong understanding of:
- PCB design (mixed-signal, low-noise, power integrity)
- Module/system integration (electronics packaging)
- Proven track record managing complex hardware programs from concept to production
- Experience working with cross-functional engineering teams and external vendors
- Strong program management fundamentals (planning tools, risk tracking, execution rigor)
Preferred Qualifications
- Experience with optical or photonics modules (ELSFP, QSFP-DD, CFP2, etc.)
- Familiarity with:
- Laser drivers, TEC controllers, and optical monitoring
- Thermal challenges in compact pluggable modules
- Coherent optical systems and sensitivity to noise
- Experience with NPI processes (EVT/DVT/PVT) and high-volume manufacturing
- Ability to engage deeply in technical trade-offs and design decisions