Head of IC Design

Role Purpose
Lead Power Integrations’ global IC design organization, ensuring the successful and predictable execution of all silicon development aligned to product architectures and Market-driven roadmaps.
This role owns the delivery of high-quality, manufacturable ICs, translating product and system requirements into silicon while maintaining strong execution discipline, risk management, and cross-functional alignment.
Working closely with Product & Technology Development, Marketing, Operations, and Business Units, this leader ensures silicon delivery meets performance, cost, quality, and schedule commitments.
Business Ownership & Impact
•    Own execution and delivery of all IC development programs.
•    Ensure predictable silicon delivery aligned to product commitments.
•    Drive improvements in:
o    First-pass silicon success
o    Development cycle time
o    Design productivity and reuse
•    Balance design innovation with execution risk and schedule confidence.
•    Ensure designs meet:
o    Performance targets
o    Cost and area targets
o    Manufacturability and yield requirements
Core Responsibilities
IC Design Execution & Delivery
•    Lead all IC development across:
o    Analog design
o    Digital design
o    Mixed-signal integration
o    Design verification
o    CAD/Layout
o    Design reuse
•    Ensure high-quality execution from specification through tape-out and silicon validation.
•    Deliver designs that meet schedule, performance, cost, and quality targets.
Alignment to Product & Marketing Requirements
•    Work closely with Product & Technology and Marketing to ensure clear translation of roadmap requirements into design specifications.
•    Provide early input on feasibility, risk, and trade-offs.
•    Maintain alignment between architecture intent and silicon implementation.
Design Methodology & Productivity
•    Establish best-in-class design methodologies, tools, and flows.
•    Drive improvements in:
o    Design reuse
o    Verification coverage
o    Silicon iterations 
o    Time-to-functioning silicon
•    Build scalable design infrastructure to support future growth.
Cross-Functional Integration
•    Partner closely with:
o    Product & Technology (architecture and requirements)
o    Marketing (roadmap alignment)
o    Operations (process, yield, cost, backend execution)
o    Business Units (application needs and priorities)
•    Ensure tight alignment between design, manufacturing, and system requirements.
Risk Management & Predictable Execution
•    Implement disciplined design and verification processes to reduce execution risk.
•    Identify and manage technical risks early in the development cycle.
•    Ensure high confidence in tape-out schedules and silicon success.
•    Drive a culture of accountability and delivery predictability.
Organizational Leadership
•    Lead global IC design teams across regions.
•    Build a strong technical culture focused on:
o    Quality
o    Execution discipline
o    Risk management
o    Design reuse
o    Continuous improvement
•    Recruit, develop, and retain top engineering talent.
Ideal Profile
•    15 years of experience in IC design (analog, mixed-signal, or power ICs).
•    Proven leadership of global IC design teams.
•    Deep expertise in:
o    High-voltage / power IC design
o    Mixed-signal integration
o    Semiconductor processes (BCD, HV, GaN preferred)
•    Strong track record of delivering silicon on schedule with high quality.
•    Experience improving design productivity and execution predictability.
•    Strong cross-functional collaboration skills across product, marketing, and operations.