Process Engineer / Tech - 2nd Shift

Summary:      

The position will primarily focus on learning and supporting wafer processing steps required to further develop and build IR emitter pixels for the IRSP program area.  This includes Photoreist coats, Photoresist develops, dry etches, descums, ultrasonic (US) resist strips, immersion wet etches, microscope inspections, and thin film metrology.  .  The successful candidate will need to develop an understanding of relevant process integration dependencies (e,g. interaction of patterned resist with etch processes). Understanding the importance of processing results and the need for supporting program schedules is critical.  As time permits, a secondary goal is to become familiar with the process flows required to fabricate advanced interconnects on passive and/or active device wafers (e.g. through-Si Vias (TSV), flip-chip bumps, Cu pillars, redistribution layers, and high density microbumps).  This position will support both externally and internally funded projects.

Essential Duties & Responsibilities:

• Hands-on engineering resource for fabricating IR emitter pixels on test and device wafers.
• Communicating results and concerns in a collaborative, data-driven environment.  
• Participate and conduct process improvement experiments, as needed; accurately recording and reporting data
• Employ standard troubleshooting protocol

Other Duties & Responsibilities:

• Comply with all safety policies, practices and procedures.
• Comply with all quality and ITAR policies, practices and procedures.
• Build meaningful and productive relationships with internal business partners.
• Participate in proactive team efforts to achieve departmental and company goals.
• Contribute to building a positive team spirit.
• Communicate effectively with all levels of employees.
• Protect confidential information by not communicating, disclosing to, or using for benefit of 3rd parties.
• Maintain the highest degree of honesty and integrity at all times.
• Perform other duties as assigned.

Job Qualifications:

• US citizenship or permanent resident alien status is required.

• A.A., B.S., M.S., or PhD in physical science or engineering with wafer processing and cleanroom experience
• Knowledge of wafer processes and basic device processing, with a good background in thin film deposition, dry/wet etch, or photolithography.
• Overall experience with metrology measurements, data recording, and data presentation (PowerPoint) is a plus.

Job Skills:

• Excellent hands-on laboratory skills

• Excellent written and verbal communication skills
• Should be able to collect and analyze data.
• Proficient in Microsoft Office.
• Be able to generate reports.
• Should possess strong analytical skills.

Benefits:

At Micross, our Core Values of integrity, communication, teamwork, quality and execution, self-discipline and accountability are cultivated throughout all levels of the organization. Micross provides a challenging and enjoyable workplace for members and supports the needs of the community.

Micross provides competitive benefits including medical, HSA and FSA plans, dental, vision, company paid basic Life Insurance, Employee Assistance Program (EAP), 401k with employer match, paid leave, vacation, holidays, generous tuition assistance, 529 College Savings, Pet insurance, Legal insurance, and a range of well-being programs available.  

www.Micross.com