What are the responsibilities and job description for the IC Packaging position at Jobs via Dice?
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Requirements
Bachelor s degree in Computer Science, Electrical Engineering or related fields and 10-15 years of related professional experience.
Master s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 5-10 years of experience.
Job Responsibilities
Requirements
Bachelor s degree in Computer Science, Electrical Engineering or related fields and 10-15 years of related professional experience.
Master s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 5-10 years of experience.
Job Responsibilities
- Experience with 2.5D package design and development like CoWoS
- Strong expertise in using IC package layout tools like Cadence APD
- Understanding IC package design requirements for high speed interfaces and setup constraints manager
- Interface with the IC physical design teams for optimizing the die floor plan
- Experience in interfacing with Substrate suppliers and OSATs
- Ability to do automation of the layout tasks using scripting
- Power plane design and translating power supply requirements into design
- Familiarity with IC packaging technologies, materials, substrate design rules and assembly rules
- Track record of new product introduction from concept through development and production is a plus
- Knowledge of the thermal and mechanical analysis of the IC package development is a plus
- A team player with strong communication, presentation, and documentation skills
