What are the responsibilities and job description for the IC Packaging position at Technical Link?
Job Details
Requirements
Bachelor s degree in Computer Science, Electrical Engineering or related fields and 10-15 years of related professional experience.
Master s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 5-10 years of experience.
Job Responsibilities
- Experience with 2.5D package design and development like CoWoS
- Strong expertise in using IC package layout tools like Cadence APD
- Understanding IC package design requirements for high speed interfaces and setup constraints manager
- Interface with the IC physical design teams for optimizing the die floor plan
- Experience in interfacing with Substrate suppliers and OSATs
- Ability to do automation of the layout tasks using scripting
- Power plane design and translating power supply requirements into design
- Familiarity with IC packaging technologies, materials, substrate design rules and assembly rules
- Track record of new product introduction from concept through development and production is a plus
- Knowledge of the thermal and mechanical analysis of the IC package development is a plus
- A team player with strong communication, presentation, and documentation skills
Employers have access to artificial intelligence language tools (“AI”) that help generate and enhance job descriptions and AI may have been used to create this description. The position description has been reviewed for accuracy and Dice believes it to correctly reflect the job opportunity.
Salary : $70 - $90
