IC Packaging Engineer

This well-funded (Series B) start-up is building a new class of high-resolution perception sensing technology for ADAS and autonomous driving.

Seeking an IC Packaging Engineer to lead the development and delivery of advanced multi-chip packaging solutions for THz-system RFIC, SoC, and high-speed digital applications. This high-impact role combines technical leadership, hands-on package design, and collaboration with OSATs, with a focus on 2.5D and interposer-based architectures. The ideal candidate will have deep expertise in package physical design (layout, stack-ups, DFM, SI/PI), thermal-mechanical modelling, and high-volume manufacturing and test, enabling them to execute designs directly or guide junior engineers toward production-ready solutions.

Responsibilities

• Technical leadership, guiding the design and execution of advanced IC packages for multi-chip RFIC/SoC integration.
• Develop 2.5D packages with UCIe chip-to-chip interconnects and interposer-based solutions.
• Work on single-sided and double-sided RDL designs and on-package RF antenna structures.
• Co-optimize package designs for signal integrity, power integrity, thermal, and mechanical performance in collaboration with RFIC, digital, and system engineers.
• Drive material selection, DFM, and reliability qualification to meet automotive-grade requirements (AEC-Q).
• Perform stress, warpage, and thermal simulations using tools such as ANSYS.
• Maintain and leverage relationships with OSATs, substrate suppliers, and ecosystem partners to accelerate development.
• Create and review electrical performance analysis (signal path length, PDN, crosstalk/noise etc.), mechanical analysis and drawings, stack-ups, and layout constraints.
• Lead failure analysis and root cause investigations for packaging and reliability issues and provide solutions to increase yield.
• Contribute to the packaging roadmap and scalability plan for automotive volume production.

Key Qualifications

• 10 years of experience in IC packaging design and development, including leadership responsibilities.
• Proven track record with multi-chip packages, digital RF integration, and automotive applications.
• Deep knowledge of UCIe interconnects, organic substrates, interposers, and advanced packaging architectures.
• Experience with RF antenna integration in package designs.
• Proficient in Flip-Chip, Fan-Out, 2.5D integration, and heterogeneous system-in-package solutions.
• Strong understanding of packaging electrical performance such as signal and power integrity, mechanical stress, thermal management, and reliability analysis.
• Established network with packaging vendors and OSATs.
• M.S. or Ph.D. in Mechanical Engineering, Materials Science, Electrical Engineering, or related field.
• Excellent communication skills and ability to thrive in a fast-paced start-up environment.

Why Join

• Technical oversight, defining packaging solutions for breakthrough ADAS technology.
• Collaborate with a world-class engineering team spanning RFIC, SoC, and system design.
• Be part of a well-funded start-up bringing innovative sensing technology to market.
• Competitive compensation, stock options, and flexible work arrangements.

Location

Hybrid work from one of our offices:

• Bay Area, CA
• Boston, MA