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IC Packaging Design Engineer

Jobs via Dice
Chandler, AZ Full Time
POSTED ON 6/12/2026
AVAILABLE BEFORE 7/10/2026
Dice is the leading career destination for tech experts at every stage of their careers. Our client, HyreU, is seeking the following. Apply via Dice today!

IC Packaging Design Engineer

LOC: Chandler, AZ or Hillsboro, OR (ONSITE)

Longterm Contract – 1 Year

No openings : 4

Skills Required

Bachelor’s or Master’s degree in Electrical /Electronics Engineering

Experience:

Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)

Candidates should have experience in the below domains:

  • Physical Design & Layout
  • Substrate design and layout
  • SI/PI aware design implementation
  • Design for performance, manufacturability, yield, and reliability
  • Design rule compliance

Salary.com Estimation for IC Packaging Design Engineer in Chandler, AZ
$84,356 to $98,468
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