What are the responsibilities and job description for the IC Packaging Design Engineer- Contract Opportunity, Open for Corp-Corp position at Q1 Technologies, Inc.?
IC Packaging Design Engineer
Skills Required
This client is looking for a high level IC Package Design Engineer to help with a new product. Bachelor’s or Master’s degree in Electrical /Electronics Engineering is recquired.
Experience:
Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)
Candidates should have experience in the below domains:
- Physical Design & Layout
- Substrate design and layout
- SI/PI aware design implementation
- Design for performance, manufacturability, yield, and reliability
- Design rule compliance
Salary : $50 - $60