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IC Packaging Design Engineer- Contract Opportunity, Open for Corp-Corp

Q1 Technologies, Inc.
Chandler, AZ Contractor
POSTED ON 6/13/2026
AVAILABLE BEFORE 7/11/2026

IC Packaging Design Engineer

Skills Required

This client is looking for a high level IC Package Design Engineer to help with a new product. Bachelor’s or Master’s degree in Electrical /Electronics Engineering is recquired.

Experience:

Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)

Candidates should have experience in the below domains:

  • Physical Design & Layout
  • Substrate design and layout
  • SI/PI aware design implementation
  • Design for performance, manufacturability, yield, and reliability
  • Design rule compliance

Salary : $50 - $60

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