TITLE:                        SR. MANUFACTURING INTEGRATION ENGINEER

FLSA STATUS:          EXEMPT

REPORTS TO:         MANAGER, PLATING MANUFACTURING ENGINEERING

SUMMARY:

Under the direction of the Manager of Plating Manufacturing Engineering, the Sr. Manufacturing Integration Engineer is responsible for monitoring, sustaining, and providing support for the manufacturing process, including detecting and correcting process errors, releasing and integrating new programs into the manufacturing line, providing guidance and support to engineers regarding experiments or evaluations, and providing feedback to the backend process group.  This position is located in Milpitas, California.

ESSENTIAL FUNCTIONS:

• Engages in process improvement activities based on Wafer Design Change Notifications (WDCN) and Wafer Process Change Notifications (WPCN), including following up with CCN documentation for line conversion activity
• Examines newly transferred products to ensure leading wafer follows wafer configuration specifications
• Evaluates sample wafers, conducts experiments, and reviews results in support of yield improvement activities; issues Lot Configuration Changes (LCC) and CCN’s as needed
• Interprets analytical defect data from imaging equipment such as FIB, SEM, EDX, and TEM
• Monitors and supports manufacturing process controls to alert for abnormal wafers; recommends corrective action if needed
• Responds to inquiries from other team members, managers, or departments
• Uses Statistical Process Control (SPC) and other complex software applications to analyze large volumes of data; develops charts or reports and presents findings before groups or teams
• Adheres to all safety policies and procedures as required
• Performs other duties of a similar nature or level*

MINIMUM QUALIFICATIONS:

• Bachelor’s degree in Chemistry, Chemical or Electrical Engineering, Materials Science, or Physics and/or equivalent relevant experience; Master’s degree preferred
• Five years of hands on experience working in either the magnetic thin film fabrication or semiconductor industries in a manufacturing or process engineering role
• Strong analytical and critical thinking skills
• Hands’ on experience in SPC and Design of Experiments (DOE)
• Proficient in the use of Microsoft Office Applications

Knowledge, Skills, and Abilities:

• Knowledge of magnetic recording head or HDD manufacturing
• Knowledge and ability to understand various defect image results from FIB, SEM, EDX, and TEM tools
• Knowledge and technical understanding of circuit design and testing
• Knowledge and experience using JMP or Excel and the ability to create macro formulas
• Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations
• Able to design complex experiments, analyze results, and recommend corrective action
• Able to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management
• Able to work productively and collaboratively with all levels of employees and management
• Able to comply with all safety policies and procedures
• Able to use critical thinking to resolve issues, examine trends, conduct root cause analysis, and make recommendations for process improvements
• Demonstrated analytical skills
• Demonstrated organizational and time management skills
• Demonstrated problem-solving and trouble shooting skills
• Flexible and able to prioritize

The annual base salary for this full-time position is between $127,967.00-$188,187.00 bonus target benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically.

WORKING CONDITIONS:

The Sr. Manufacturing Integration Engineer works primarily in an office environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. Works in a class 100 ESD sensitive wafer manufacturing facility; wears a cleanroom (bunny) suit, including hood, gloves, safety glasses, booties, and mask.  May be exposed to hazardous conditions, chemicals, fumes, and/or gases during the course of workday; may be exposed to loud noise. Stands, walks, bends, and twists. Performs various fine grasping movements; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment; may occasionally be required to push, pull, or lift up to 30 pounds.

*Other duties of a similar nature or level are duties that may be required, but may not be specifically listed in the job description or posting.

TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics.  Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.

Salary : $127,967 - $188,187