Demo

Package Design Engineer

Goldenpick Technologies
San Jose, CA Contractor
POSTED ON 11/19/2025
AVAILABLE BEFORE 1/18/2026
Requirements/Skills: ​Possess Mentor Graphics, Cadence, PLA knowledge​Multiple layers package design (8 ) experience ​Understanding of substrate manufacturing design rule and assembly rule​Possess Flip Chip Package Design Concept​Good communication skill.​May require vendor on-site support

Salary : $159,400

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