What are the responsibilities and job description for the Senior Assembly Process Engineer position at Cypress HCM?
Position Summary
Experienced Assembly Process Engineer with strong expertise in semiconductor back-end manufacturing processes. Responsible for developing, optimizing, and sustaining high-yield assembly operations including die attach, wire bonding, flip chip, wafer thinning, dicing, and molding. This role drives process improvement, yield enhancement, cost reduction, and equipment evaluation while supporting customer technical requirements.
Key Responsibilities
Experienced Assembly Process Engineer with strong expertise in semiconductor back-end manufacturing processes. Responsible for developing, optimizing, and sustaining high-yield assembly operations including die attach, wire bonding, flip chip, wafer thinning, dicing, and molding. This role drives process improvement, yield enhancement, cost reduction, and equipment evaluation while supporting customer technical requirements.
Key Responsibilities
- Provide technical engineering support for semiconductor assembly processes.
- Review customer technical requirements and specifications to determine appropriate manufacturing processes and materials.
- Manage and optimize back-end semiconductor assembly processes.
- Lead Design of Experiments (DOE) for new process development and productivity improvement.
- Perform Statistical Process Control (SPC) and yield analysis.
- Analyze assembly yield data and production equipment performance.
- Generate technical documentation including process specifications, experimental reports, and validation studies.
- Conduct root cause analysis (RCA) and implement corrective and preventive actions (CAPA).
- Identify and implement cost reduction, quality improvement, and yield enhancement initiatives.
- Evaluate and recommend new capital equipment to improve manufacturing capabilities.
- Collaboricate cross-functionally with production, quality, engineering, and customer teams.
- Support continuous improvement initiatives using Lean manufacturing and Six Sigma methodologies.
- Bachelor’s Degree in Electrical Engineering, Mechanical Engineering, Materials Science, or related technical field.
- 10 years of semiconductor assembly process engineering experience.
- Hands-on experience in semiconductor back-end manufacturing.
- Strong experience with die attach, wire bonding, molding, flip chip, wafer thinning, and dicing.
- Advanced knowledge of semiconductor packaging processes.
- Experience with Design of Experiments (DOE).
- Experience with Statistical Process Control (SPC).
- Experience with Failure Mode and Effects Analysis (FMEA).
- Strong data analysis and yield improvement experience.