What are the responsibilities and job description for the Senior IC Packaging Design Engineer position at Best NanoTech?
Senior IC Packaging Design Engineer
Location, Work Mode & Experience
Location: Chandler, Arizona OR Hillsboro, Oregon (Onsite)
Employment: Long-Term Contract (12 Months)
Experience: 6 10 Years
Role Overview
We are looking for an experienced IC Packaging Design Engineer to develop advanced semiconductor package solutions for high-performance products. The role requires strong expertise in package layout, substrate implementation, SI/PI-aware design, manufacturability, and collaboration with package architects and system engineers.
Key Responsibilities
- Develop complex IC package layouts for advanced semiconductor products.
- Design high-density substrates using Siemens Xpedition or Cadence APD.
- Perform package floorplanning and routing.
- Work closely with SI/PI engineers during package implementation.
- Optimize package performance for signal integrity and power delivery.
- Ensure compliance with manufacturing and reliability requirements.
- Support package architecture implementation.
- Review package design quality and design rule compliance.
- Resolve package layout issues.
- Support engineering change implementation.
- Mentor junior package designers.
- Participate in design reviews with global engineering teams.
Required Qualifications
- Bachelor's or Master's degree in Electrical/Electronics Engineering.
- 6 10 years of IC Packaging Design experience.
- Strong experience with substrate layout and package implementation.
- Experience designing advanced semiconductor packages.
Technical Skills EDA Tools
- Siemens Xpedition (XPD)
- Cadence APD
- Cadence Allegro
- Cadence SiP
Advanced Packaging
- Advanced Package Design
- High Density Substrate Design
- Flip Chip Packaging
- Multi-layer Package Design
- Package Floorplanning
Physical Design
- Physical Package Layout
- Design Rule Compliance
- Manufacturing Constraints
- Yield Optimization
Electrical Performance
- Signal Integrity (SI)
- Power Integrity (PI)
- Reliability
- Design for Manufacturability (DFM)
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