What are the responsibilities and job description for the Lead / Principal IC Packaging Design Engineer position at Best NanoTech?
Lead / Principal IC Packaging Design Engineer
Location, Work Mode & Experience
Location: Chandler, Arizona OR Hillsboro, Oregon (Onsite)
Employment: Long-Term Contract (12 Months)
Experience: 10 Years
Role Overview
We are seeking a Lead IC Packaging Design Engineer with extensive experience in advanced semiconductor package development. This role will lead package implementation, guide complex substrate designs, collaborate with architecture, SI/PI, manufacturing, and reliability teams, and drive high-quality package solutions from concept through production.
Key Responsibilities
- Lead advanced semiconductor package design projects.
- Drive complete package implementation using Siemens Xpedition or Cadence APD.
- Define substrate architecture and layout strategy.
- Lead SI/PI-aware package implementation.
- Ensure package manufacturability, yield, and reliability.
- Review package floorplans and routing methodologies.
- Drive design rule compliance across projects.
- Collaborate with architecture, manufacturing, and reliability teams.
- Resolve complex package design challenges.
- Mentor package design engineers.
- Support customer reviews and technical discussions.
- Contribute to package design process improvements and best practices.
Required Qualifications
- Bachelor's or Master's degree in Electrical/Electronics Engineering.
- 10 years of IC Packaging Design experience.
- Proven experience leading advanced package design programs.
- Strong knowledge of package architecture, substrate design, and package implementation.
Technical Skills Package Design Platforms
- Siemens Xpedition (Mentor Graphics XPD)
- Cadence APD
- Cadence Allegro
- Cadence SiP
Advanced Semiconductor Packaging
- Package Architecture
- High-Density Substrate Design
- Advanced Package Layout
- Flip Chip
- Multi-Chip Package Design
- SiP Package Design
Design Engineering
- Physical Package Design
- SI/PI Optimization
- Reliability Engineering
- Yield Improvement
- Design Rule Compliance
- Design for Manufacturability (DFM)
Leadership
- Technical Leadership
- Design Reviews
- Engineering Mentorship
- Cross-functional Collaboration
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