Electro-Optic Packaging Engineer

MECHANICAL ENGINEER - Optical Packaging Design Engineer

Senior Electro-optics Packaging Engineer will spearhead mechanical design and development of next generation integrated optics modules, specialized in designing high-performance, EO modules in a compact form factor. This position requires experience with broad design, analysis, and simulation of electro-optics, materials, IC assembly, and packaging of integrated optical assemblies. The candidate will apply customer form-factor and environmental constraints to guide the design of optical and electrical hardware, realizing micro-radian alignment stabilities in dynamic temperature, shock, and vibration environments.

The candidate will be responsible for designing and verifying optical-mechanical structures, thermal integrity and durability, and perform optical/thermal/package structural design, analysis, simulation, and verification. Must be able to work independently to model components and assemblies using CAE/CAD tools; FEA structural analysis, including linear, nonlinear and dynamic studies using software; Familiar with high thermal conductivity materials, thermal analysis, and coupled-physics involving thermal–structural, thermal-mechanical stress and thermo-electric analysis; Hands-on experience in with SolidWorks, ANSYS, and COMSOL. Perform thermal/mechanical/optical analysis using ANSYS and other FEA design/simulation tools. 3D packaging design experience is preferred.

REQUIREMENTS:

To qualify for consideration, candidates must have the following to qualify

·       10 years direct experience in development of optical and IC packaging and assembly processes.

·       U.S. Citizenship or permanent resident status required.

·       Experienced with optical bench design

·       Experience with engineering tools for fiber alignment, with wire bonding, flip-chip bonding and fiber packaging

·       Knowledge and practical experience in characterization of semiconductor lasers and photo-diodes

·       Strong academic background and knowledge of microelectronics, electro-optic packaging design and assembly, and experienced with low out gassing adhesives

·       Knowledgeable in packaging technologies and processes, familiar with glass/ceramic/metal material properties and multi-layer materials interfaces after bonding, flip-chip/BGA/PCBA/Flex design reliability and processing. Experience in 3D electro-optic or IC packaging design and process

·       Practical experience with Solid Works and FEA simulation tools (e.g., ANSYS)

·       Knowledgeable in materials property and process, yield analysis and enhancement, failure mode and analysis, quality tools, such as DOE, SPC, and Six-Sigma process and analysis; Familiar with Industry Test Standards, such as JEDEC, EIA, Telcordia, Mil-Std, etc.

EDUCATION:

BS degree in Mechanical or Electrical Engineering, Physics, Applied Physics, or equivalent, MS or PhD preferred.

Salary Range: $125,000 to $150,000 per annum.

Final compensation will be determined by factors such as the candidate's specific skills, depth of experience, and interview performance.

Applications

Submit a resume with a cover letter explaining how you qualify and would excel in this position. If selected for an interview, you will be required to provide a 30-minute presentation on your qualifications and relevant technical work, experience and accomplishments.

ABOUT US:

APIC Corporation, based in Culver City, California, has driven innovation in photonics for 25 years. We develop heterogeneously integrated photonic and electronics (chip-scale optical links and networks) that propel future computer systems beyond Moore’s Law. Backed by $150 million in government grants and partnerships —we are shifting from R&D to prototyping and volume production of photonically enhanced edge and embedded computing platforms. APIC is partnered with the Air Force Research Laboratory, Oak Ridge National Laboratory and AIM Photonics. Our ultimate vision is to architect next-generation AI data centers, supercomputers, and embedded AI systems.