IC Packaging Mechanical Design Engineer - (New Providence, NJ)

Join a growing engineering team and develop cutting-edge optical modules for high-performance computing.

Responsibilities:

• Design innovative packaging solutions for optical modules
• Develop testing procedures and ensure product reliability
• Troubleshoot technical challenges in packaging and materials
• Build and maintain component models and technical drawings
• Collaborate with internal and external teams for seamless integration

Qualifications:

• BS in Mechanical Engineering
• 2 years of IC package design experience Or Ph.D. in Mechanical Engineering
• Excellent communication skills

Preferred Skills:

• SolidWorks (PDM) & FEA tools (ANSYS Mechanical)
• Rapid prototyping (Formlabs 3D printing a plus)
• Design for manufacturing (CNC, casting, MIM)
• Optical module reliability (Telcordia GR-468)
• Advanced IC packaging technologies (3D/2.5D IC, FOWLP, MCM FC-BGA)
• High-speed test socket and connector experience