What are the responsibilities and job description for the Advanced Packaging Engineer position at Vivid Technology?
This well-funded (Series B) start-up is building a new class of high-resolution perception sensing technology for ADAS and autonomous driving.
Seeking an IC Packaging Engineer to lead the development and delivery of advanced multi-chip packaging solutions for THz-system RFIC, SoC, and high-speed digital applications. This high-impact role combines technical leadership, hands-on package design, and collaboration with OSATs, with a focus on 2.5D and interposer-based architectures. The ideal candidate will have deep expertise in package physical design (layout, stack-ups, DFM, SI/PI), thermal-mechanical modelling, and high-volume manufacturing and test, enabling them to execute designs directly or guide junior engineers toward production-ready solutions.
Responsibilities
- Technical leadership, guiding the design and execution of advanced IC packages for multi-chip RFIC/SoC integration.
- Develop 2.5D packages with UCIe chip-to-chip interconnects and interposer-based solutions.
- Work on single-sided and double-sided RDL designs and on-package RF antenna structures.
- Co-optimize package designs for signal integrity, thermal, and mechanical performance in collaboration with RFIC, digital, and system engineers.
- Drive material selection, DFM, and reliability qualification to meet automotive-grade requirements (AEC-Q).
- Perform stress, warpage, and thermal simulations using tools such as ANSYS.
- Maintain and leverage relationships with OSATs, substrate suppliers, and ecosystem partners to accelerate development.
- Create and review mechanical drawings, stack-ups, and layout constraints.
- Lead failure analysis and root cause investigations for packaging and reliability issues.
- Contribute to the packaging roadmap and scalability plan for automotive volume production.
Key Qualifications
- 10 years of experience in IC packaging design and development, including leadership responsibilities.
- Proven track record with multi-chip packages, digital RF integration, and automotive applications.
- Deep knowledge of UCIe interconnects, interposers, and advanced packaging architectures.
- Experience with RF antenna integration in package designs.
- Proficient in Flip-Chip, Fan-Out, 2.5D integration, and heterogeneous system-in-package solutions.
- Strong understanding of signal integrity, mechanical stress, thermal management, and reliability analysis.
- Established network with packaging vendors and OSATs.
- M.S. or Ph.D. in Mechanical Engineering, Materials Science, Electrical Engineering, or related field.
- Excellent communication skills and ability to thrive in a fast-paced start-up environment.