What are the responsibilities and job description for the Test Engineer position at Tower Semiconductor?
Job Description
In this role, you will be responsible for developing, improving, and sustaining end-of-line electrical and optical testing of advanced analog devices. You will support new technology transfers while coordinating the introduction, qualification, and volume ramp of new products for foundry customers. Collaboration is central to this position. You will interact and work closely with Process Engineering, Equipment Engineering, Operations, and R&D groups on inter-departmental and cross-functional initiatives. Additionally, you will engage with customers to resolve technical issues and deliver comprehensive project summaries and updates. You will also coordinate with failure analysis efforts, analyze electrical test and yield data, and provide actionable feedback to engineers and managers to drive continuous improvement in manufacturing processes.
This Job Is For You If
- You can analyze optical characterization, electrical test and yield data, disposition problem wafers and lots, and write test procedures, specifications, documentation, and test programs.
- You can utilize advanced analytical tools and techniques and participate in teams to solve wafer fabrication problems.
- You can write process capability reports for process engineering and customer review.
- You can lead or participate in intra- or inter-departmental efforts to manage process crises: containing damage, investigating and identifying root causes, and implementing corrective and preventive actions.
- You can participate in inter-departmental projects toward technology development and yield enhancement.
- You can help drive continuous improvement projects to improve D0's, reduce scrap, and enhance device performance.
Job Requirements
- BS in Electrical or Chemical Engineering, Physics or Materials Science.
- Candidates with process and/or device experience and optical characterization experience highly preferred.
- Ability to communicate and present technical concepts and analysis in an effective manner.
- Knowledge and experience in one or more of the following areas: Process Integration, Device Physics, Thin Films, Etch, CMP, Photolithography, Diffusion, CMP, Implant, E-Test.
- Experience with SPC and DOE is required, 8D, FMEA, and structured problem solving is preferred.