Failure Analysis Engineer

Job Description

Our Failure Analysis (FA) team is responsible for investigating and identifying the root cause of failures and defects from internal semiconductor silicon wafers manufacturing to external customer returns through the close collaboration will with manufacturing (fab), process engineering, integration and quality assurance teams to determine the failure mechanisms.

This position requires you to

Perform FA to localize and characterize the failures and defects with advanced tools and techniques to help engineering teams identify the root causes and find the solutions.

Develop the test method for special FA cases and be able to interpret the test data to internal and external customers.

Work hands-on with both Electrical and Physical FA techniques such as:

• Emission Microscopy (EMMI)
• OBIRCH (Optical Beam Induced Resistance Change)
• Bench Testing
• SEM (Scanning Electron Microscopy)
• FIB (Focused Ion Beam)
• De-processing

This Job Is For You If

• Can work independently and “think out of the box”
• Have a lot of patience and look for into findings and solutions

Job Requirements

• B.Sc in Electrical engineering or related field, preference to M.Sc
• Have knowledge in FA tools and methods. Experience and knowledge in electrical FA tests is preferred
• Familiar with Semiconductor devices and electrical circuits is a must

Compensation

Level 1 - 3 $74,000 - 116,000